Jialin Zhang , Hangqian Wang , Tao Wang , Xialei Lv , Jinhui Li , Shuye Zhang , Guoping Zhang , Rong Sun
{"title":"Functionalized polyimide reactive macromer enhanced alkali-soluble photosensitive polymer for solder resist material","authors":"Jialin Zhang , Hangqian Wang , Tao Wang , Xialei Lv , Jinhui Li , Shuye Zhang , Guoping Zhang , Rong Sun","doi":"10.1016/j.polymer.2025.128739","DOIUrl":null,"url":null,"abstract":"<div><div>Polyimide (PI) exhibits excellent comprehensive properties due to its unique molecular structure. In this study, PI reactive macromer was introduced as an additive into alkali-soluble photocurable epoxy resin (EP) to serve as the matrix resin for solder resist (SR), and the enhancing effects of PI reactive macromer on the performance of solder resist materials were systematically evaluated. By capitalizing on the superior properties of PI and its ideal chemical compatibility with EP, SR achieved significant improvements in high flexibility, high heat resistance, and other properties. The results indicate that the addition of PI reactive macromer exhibited remarkable thermodynamic enhancement effects. SR-2 with 20 wt% PI addition demonstrated a tensile strength of 89.6 MPa, an elongation at break of 5.8 %, and a glass transition temperature of 177.1 °C. Additionally, SR-2 exhibited low dielectric constant, low water absorption, high adhesion, good resolution, and excellent acid and alkali resistance. This study provides a scalable strategy for the design of SR matrix resins. Integrating the intrinsic benefits of PI reactive macromer with alkali-soluble photocurable resin, it lays the foundation for developing next-generation SR to meet the demands of modern electronic manufacturing.</div></div>","PeriodicalId":405,"journal":{"name":"Polymer","volume":"334 ","pages":"Article 128739"},"PeriodicalIF":4.1000,"publicationDate":"2025-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0032386125007256","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0
Abstract
Polyimide (PI) exhibits excellent comprehensive properties due to its unique molecular structure. In this study, PI reactive macromer was introduced as an additive into alkali-soluble photocurable epoxy resin (EP) to serve as the matrix resin for solder resist (SR), and the enhancing effects of PI reactive macromer on the performance of solder resist materials were systematically evaluated. By capitalizing on the superior properties of PI and its ideal chemical compatibility with EP, SR achieved significant improvements in high flexibility, high heat resistance, and other properties. The results indicate that the addition of PI reactive macromer exhibited remarkable thermodynamic enhancement effects. SR-2 with 20 wt% PI addition demonstrated a tensile strength of 89.6 MPa, an elongation at break of 5.8 %, and a glass transition temperature of 177.1 °C. Additionally, SR-2 exhibited low dielectric constant, low water absorption, high adhesion, good resolution, and excellent acid and alkali resistance. This study provides a scalable strategy for the design of SR matrix resins. Integrating the intrinsic benefits of PI reactive macromer with alkali-soluble photocurable resin, it lays the foundation for developing next-generation SR to meet the demands of modern electronic manufacturing.
期刊介绍:
Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics.
The main scope is covered but not limited to the following core areas:
Polymer Materials
Nanocomposites and hybrid nanomaterials
Polymer blends, films, fibres, networks and porous materials
Physical Characterization
Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films
Polymer Engineering
Advanced multiscale processing methods
Polymer Synthesis, Modification and Self-assembly
Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization
Technological Applications
Polymers for energy generation and storage
Polymer membranes for separation technology
Polymers for opto- and microelectronics.