A Brushless DC Motor Driver Chip With Adaptive Synchronous Rectification

IF 1.7 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Yifeng Peng, Jianxiong Xi, Ao Li, Lenian He, Anming Gao, Wei Jiang
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引用次数: 0

Abstract

Brushless DC (BLDC) motor driver chips are widely used in household appliances, robots, automobiles, etc. The three-phase bridge driver is a common driving structure for BLDC motors. This paper proposes a BLDC motor driver chip with an internal bridge driver using lateral double-diffused metal-oxide semiconductor (LDMOS). It has an adaptive synchronous rectification (SR) controller, which controls the output current of the bridge driver to regulate the speed of the BLDC motor. The SR controller is integrated in the chip, possessing the features of optimized dead time to decrease external loss caused by dead time. This work also proposes a high-side gate driver with real-time switch detection, which ensures the SR controller receives the work state of high-side power LDMOS. The chip is fabricated in a 0.18 µm BCD SOI technology and adopts a QFN package. The experimental results show that the chip's continuous and peak output current are respectively 5 A and 10 A, the maximum efficiency of the chip reaches 93.4%, and the maximum power density of the whole driver module is 12 W/cm3.

一种自适应同步整流的无刷直流电动机驱动芯片
无刷直流(BLDC)电机驱动芯片广泛应用于家电、机器人、汽车等领域。三相桥式驱动器是无刷直流电机常用的驱动结构。提出了一种采用横向双扩散金属氧化物半导体(LDMOS)的无刷直流电机驱动芯片。它具有自适应同步整流(SR)控制器,控制桥式驱动器的输出电流来调节无刷直流电机的转速。芯片内集成了SR控制器,具有优化死区时间的特点,减少了死区时间带来的外部损耗。本工作还提出了一种具有实时开关检测的高侧栅极驱动器,保证SR控制器接收到高侧功率LDMOS的工作状态。该芯片采用0.18µm BCD SOI工艺制造,采用QFN封装。实验结果表明,该芯片的连续输出电流为5 A,峰值输出电流为10 A,芯片的最高效率达到93.4%,整个驱动模块的最大功率密度为12 W/cm3。
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来源期刊
IET Power Electronics
IET Power Electronics ENGINEERING, ELECTRICAL & ELECTRONIC-
CiteScore
5.50
自引率
10.00%
发文量
195
审稿时长
5.1 months
期刊介绍: IET Power Electronics aims to attract original research papers, short communications, review articles and power electronics related educational studies. The scope covers applications and technologies in the field of power electronics with special focus on cost-effective, efficient, power dense, environmental friendly and robust solutions, which includes: Applications: Electric drives/generators, renewable energy, industrial and consumable applications (including lighting, welding, heating, sub-sea applications, drilling and others), medical and military apparatus, utility applications, transport and space application, energy harvesting, telecommunications, energy storage management systems, home appliances. Technologies: Circuits: all type of converter topologies for low and high power applications including but not limited to: inverter, rectifier, dc/dc converter, power supplies, UPS, ac/ac converter, resonant converter, high frequency converter, hybrid converter, multilevel converter, power factor correction circuits and other advanced topologies. Components and Materials: switching devices and their control, inductors, sensors, transformers, capacitors, resistors, thermal management, filters, fuses and protection elements and other novel low-cost efficient components/materials. Control: techniques for controlling, analysing, modelling and/or simulation of power electronics circuits and complete power electronics systems. Design/Manufacturing/Testing: new multi-domain modelling, assembling and packaging technologies, advanced testing techniques. Environmental Impact: Electromagnetic Interference (EMI) reduction techniques, Electromagnetic Compatibility (EMC), limiting acoustic noise and vibration, recycling techniques, use of non-rare material. Education: teaching methods, programme and course design, use of technology in power electronics teaching, virtual laboratory and e-learning and fields within the scope of interest. Special Issues. Current Call for papers: Harmonic Mitigation Techniques and Grid Robustness in Power Electronic-Based Power Systems - https://digital-library.theiet.org/files/IET_PEL_CFP_HMTGRPEPS.pdf
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