Connectivity-Agnostic Built-In Self-Repair of Interconnects in a Chiplet IC

IF 2.7 3区计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems Pub Date : 2024-12-31 DOI:10.1109/TCAD.2024.3524473

Chi Lai;Shi-Yu Huang

引用次数: 0

Abstract

In a chiplet IC, several dice are integrated through die-to-die interconnects. Technical challenges still exist for the repair of these die-to-die interconnects to boost the overall manufacturing yield. In this work, we propose a novel Connectivity-Agnostic Built-In Self-Repair (BISR) scheme for chiplet ICs. In our scheme, the design-for-BISR circuit inserted in each functional die except the master die is independent of the die-to-die connectivity so that a nonmaster die can be repeatedly reused in many chiplet ICs while supporting in-the-field repair of faulty interconnects to boost the manufacturing yield and in-the-field reliability.

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小片集成电路中互连的连接不可知内置自修复

在小片集成电路中，几个骰子通过模对模互连集成在一起。修复这些模对模互连以提高整体制造良率的技术挑战仍然存在。在这项工作中，我们提出了一种新的连接不可知论内置自修复（BISR）方案。在我们的方案中，除主芯片外的每个功能芯片中插入的专为bisr设计的电路独立于芯片到芯片的连接，因此非主芯片可以在许多芯片ic中重复使用，同时支持故障互连的现场修复，以提高制造良率和现场可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 工程技术-工程：电子与电气

CiteScore

5.60

自引率

13.80%

发文量

500

审稿时长

7 months

期刊介绍： The purpose of this Transactions is to publish papers of interest to individuals in the area of computer-aided design of integrated circuits and systems composed of analog, digital, mixed-signal, optical, or microwave components. The aids include methods, models, algorithms, and man-machine interfaces for system-level, physical and logical design including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, hardware-software co-design and documentation of integrated circuit and system designs of all complexities. Design tools and techniques for evaluating and designing integrated circuits and systems for metrics such as performance, power, reliability, testability, and security are a focus.