Seunghyun Hwang;Michael Joseph Smith;Vinicius C. Do Nascimento;Qiang Qiu;Cheng-Kok Koh;Ganesh Subbarayan;Dan Jiao
{"title":"Real-Time 3-D Thermal Simulation of Advanced Packages via Generative Adversarial Networks","authors":"Seunghyun Hwang;Michael Joseph Smith;Vinicius C. Do Nascimento;Qiang Qiu;Cheng-Kok Koh;Ganesh Subbarayan;Dan Jiao","doi":"10.1109/TCAD.2024.3522878","DOIUrl":null,"url":null,"abstract":"Thermal optimization plays a crucial role in the design of advanced systems in package. Due to the large number of thermal simulations needed for full design space exploration, reductions in simulation run-time are critical. Here, we propose a data-driven approach to physics simulation by using neural networks (NNs) to cast the temperature solution process into an image-to-image translation problem. We first model the power generation map, conductivity map, and boundary conditions (BCs) into separate channels of an image. We then generate temperature solutions by training a generative adversarial network, composed of a U-Net shaped generator and a discriminator. The resultant NN model can handle diverse thermal simulation scenarios with accuracy. More importantly, our model can handle BCs, power maps, and physical package designs which are unseen during the training. Experiments show that speed wise, it enables near real-time design, providing a <inline-formula> <tex-math>$2581\\times $ </tex-math></inline-formula> and <inline-formula> <tex-math>$9171\\times $ </tex-math></inline-formula> speedup over a custom sparse matrix optimized finite element method and ABAQUS, respectively. Comparisons with state-of-the-art methods have demonstrated the accuracy, efficiency, and versatility of the proposed work.","PeriodicalId":13251,"journal":{"name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","volume":"44 7","pages":"2439-2450"},"PeriodicalIF":2.9000,"publicationDate":"2024-12-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10816122/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
Thermal optimization plays a crucial role in the design of advanced systems in package. Due to the large number of thermal simulations needed for full design space exploration, reductions in simulation run-time are critical. Here, we propose a data-driven approach to physics simulation by using neural networks (NNs) to cast the temperature solution process into an image-to-image translation problem. We first model the power generation map, conductivity map, and boundary conditions (BCs) into separate channels of an image. We then generate temperature solutions by training a generative adversarial network, composed of a U-Net shaped generator and a discriminator. The resultant NN model can handle diverse thermal simulation scenarios with accuracy. More importantly, our model can handle BCs, power maps, and physical package designs which are unseen during the training. Experiments show that speed wise, it enables near real-time design, providing a $2581\times $ and $9171\times $ speedup over a custom sparse matrix optimized finite element method and ABAQUS, respectively. Comparisons with state-of-the-art methods have demonstrated the accuracy, efficiency, and versatility of the proposed work.
期刊介绍:
The purpose of this Transactions is to publish papers of interest to individuals in the area of computer-aided design of integrated circuits and systems composed of analog, digital, mixed-signal, optical, or microwave components. The aids include methods, models, algorithms, and man-machine interfaces for system-level, physical and logical design including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, hardware-software co-design and documentation of integrated circuit and system designs of all complexities. Design tools and techniques for evaluating and designing integrated circuits and systems for metrics such as performance, power, reliability, testability, and security are a focus.