Real-Time 3-D Thermal Simulation of Advanced Packages via Generative Adversarial Networks

IF 2.9 3区 计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Seunghyun Hwang;Michael Joseph Smith;Vinicius C. Do Nascimento;Qiang Qiu;Cheng-Kok Koh;Ganesh Subbarayan;Dan Jiao
{"title":"Real-Time 3-D Thermal Simulation of Advanced Packages via Generative Adversarial Networks","authors":"Seunghyun Hwang;Michael Joseph Smith;Vinicius C. Do Nascimento;Qiang Qiu;Cheng-Kok Koh;Ganesh Subbarayan;Dan Jiao","doi":"10.1109/TCAD.2024.3522878","DOIUrl":null,"url":null,"abstract":"Thermal optimization plays a crucial role in the design of advanced systems in package. Due to the large number of thermal simulations needed for full design space exploration, reductions in simulation run-time are critical. Here, we propose a data-driven approach to physics simulation by using neural networks (NNs) to cast the temperature solution process into an image-to-image translation problem. We first model the power generation map, conductivity map, and boundary conditions (BCs) into separate channels of an image. We then generate temperature solutions by training a generative adversarial network, composed of a U-Net shaped generator and a discriminator. The resultant NN model can handle diverse thermal simulation scenarios with accuracy. More importantly, our model can handle BCs, power maps, and physical package designs which are unseen during the training. Experiments show that speed wise, it enables near real-time design, providing a <inline-formula> <tex-math>$2581\\times $ </tex-math></inline-formula> and <inline-formula> <tex-math>$9171\\times $ </tex-math></inline-formula> speedup over a custom sparse matrix optimized finite element method and ABAQUS, respectively. Comparisons with state-of-the-art methods have demonstrated the accuracy, efficiency, and versatility of the proposed work.","PeriodicalId":13251,"journal":{"name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","volume":"44 7","pages":"2439-2450"},"PeriodicalIF":2.9000,"publicationDate":"2024-12-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10816122/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0

Abstract

Thermal optimization plays a crucial role in the design of advanced systems in package. Due to the large number of thermal simulations needed for full design space exploration, reductions in simulation run-time are critical. Here, we propose a data-driven approach to physics simulation by using neural networks (NNs) to cast the temperature solution process into an image-to-image translation problem. We first model the power generation map, conductivity map, and boundary conditions (BCs) into separate channels of an image. We then generate temperature solutions by training a generative adversarial network, composed of a U-Net shaped generator and a discriminator. The resultant NN model can handle diverse thermal simulation scenarios with accuracy. More importantly, our model can handle BCs, power maps, and physical package designs which are unseen during the training. Experiments show that speed wise, it enables near real-time design, providing a $2581\times $ and $9171\times $ speedup over a custom sparse matrix optimized finite element method and ABAQUS, respectively. Comparisons with state-of-the-art methods have demonstrated the accuracy, efficiency, and versatility of the proposed work.
基于生成对抗网络的高级封装实时三维热仿真
热优化在先进封装系统的设计中起着至关重要的作用。由于整个设计空间探索需要大量的热模拟,因此减少模拟运行时间至关重要。在这里,我们提出了一种数据驱动的物理模拟方法,通过使用神经网络(nn)将温度求解过程转换为图像到图像的转换问题。我们首先将发电图、电导率图和边界条件(bc)建模为图像的单独通道。然后,我们通过训练一个生成对抗网络来生成温度解,该网络由一个u型生成器和一个鉴别器组成。所得到的神经网络模型可以准确地处理各种热模拟场景。更重要的是,我们的模型可以处理bc、功率图和物理包装设计,这些在训练过程中是看不见的。实验表明,在速度方面,它可以实现接近实时的设计,比自定义稀疏矩阵优化有限元方法和ABAQUS分别提供$2581\ $和$9171\ $的加速。与最先进的方法进行比较,证明了所提出工作的准确性、效率和通用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
5.60
自引率
13.80%
发文量
500
审稿时长
7 months
期刊介绍: The purpose of this Transactions is to publish papers of interest to individuals in the area of computer-aided design of integrated circuits and systems composed of analog, digital, mixed-signal, optical, or microwave components. The aids include methods, models, algorithms, and man-machine interfaces for system-level, physical and logical design including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, hardware-software co-design and documentation of integrated circuit and system designs of all complexities. Design tools and techniques for evaluating and designing integrated circuits and systems for metrics such as performance, power, reliability, testability, and security are a focus.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信