Automated desktop wiring of micromodular electronic systems with submicron electrohydrodynamic jet printed interconnects

Abstract

Wiring microscale modular electrical components into functional circuits presents significant challenges in fabricating high-resolution interconnects through contactless, maskless processes and aligning them reliably with imprecisely placed components. This work introduces an integrated, desktop-scale process flow for assembling high-performance micromodular electronic systems, by synergistically combining: (1) modularized components for seamless electrical interconnection under ambient conditions, (2) vision-assisted adaptive routing to compensate for irregular placement and orientation, and (3) electrohydrodynamic jet printing for submicron-resolution interconnect fabrication. Physical interface requirements (e.g., approach angle, overlay count, continuation length, and deviation tolerance) and process constraints (e.g., nozzle idle time, crosstalk spacing, and stage acceleration limits) are embedded directly into routing algorithms to ensure reliable, high-quality interconnect formation. Statistical evaluation demonstrates high routing feasibility and runtime efficiency across varying circuit complexities and layout conditions. Experimental validation using micromodular n-MOSFETs as building blocks successfully assembled transistor test structures and depletion-load nMOS inverters, achieving 650 nm interconnect resolution, 82% device-level yield, and excellent transistor characteristics including sub-1 V threshold voltages and electron mobilities exceeding 600 cm${}^2$/(V$\cdot$s). This adaptive, process-aware routing framework advances the integration of additive manufacturing and modular microelectronics, paving the way for scalable, robust, and highly customizable electronic systems.