{"title":"Preparation and performance study of sodium silicate-diamond composite thermal management materials","authors":"Leibo Huang , Zhengxin Li , Mohib Ullah , Yonggang Guo","doi":"10.1016/j.diamond.2025.112569","DOIUrl":null,"url":null,"abstract":"<div><div>Thermally conductive adhesives have become a significant research hotspot and have found broad applications in electronics and thermal management due to their excellent physical and chemical properties. However, the increasing demand for efficient heat dissipation in advanced electronics requires better adhesive performance. This study presents a novel inorganic thermally conductive adhesive using sodium silicate as the matrix and diamond micropowders as fillers. To enhance interfacial compatibility, diamond micropowders were surface-etched to increase surface area and functionalized with a silane coupling agent. Additionally, diamond micropowders with different sizes were blended in specific mass ratios to optimize performance, clearly demonstrating the systematic influence of diamond content on adhesive properties. The results clearly show that etching treatment of diamond micropowders enhances both the bonding performance and thermal conductivity of the adhesive. With increasing diamond content, the adhesive strength first increases and then decreases, reaching a peak at a filler mass fraction of 60 %. A similar trend was observed for the thermal conductivity, reaching a maximum at 50 % diamond content. The thermally conductive adhesive prepared with etched diamond micropowders exhibits a maximum tensile shear strength of 1.98 MPa and the highest thermal conductivity of 6.32 W·m<sup>−1</sup>·K<sup>−1</sup>. Furthermore, the thermal stability was improved, with the adhesive containing 80 % diamond micropowders losing only 2.06 % of its weight when heated from room temperature to 550 °C. Thus, we realize that controlling the content of diamond micropowders yields optimal bonding strength, improved thermal conductivity and excellent thermal stability, showing a greater potential for electronic thermal management.</div></div>","PeriodicalId":11266,"journal":{"name":"Diamond and Related Materials","volume":"157 ","pages":"Article 112569"},"PeriodicalIF":5.1000,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Diamond and Related Materials","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0925963525006260","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}
引用次数: 0
Abstract
Thermally conductive adhesives have become a significant research hotspot and have found broad applications in electronics and thermal management due to their excellent physical and chemical properties. However, the increasing demand for efficient heat dissipation in advanced electronics requires better adhesive performance. This study presents a novel inorganic thermally conductive adhesive using sodium silicate as the matrix and diamond micropowders as fillers. To enhance interfacial compatibility, diamond micropowders were surface-etched to increase surface area and functionalized with a silane coupling agent. Additionally, diamond micropowders with different sizes were blended in specific mass ratios to optimize performance, clearly demonstrating the systematic influence of diamond content on adhesive properties. The results clearly show that etching treatment of diamond micropowders enhances both the bonding performance and thermal conductivity of the adhesive. With increasing diamond content, the adhesive strength first increases and then decreases, reaching a peak at a filler mass fraction of 60 %. A similar trend was observed for the thermal conductivity, reaching a maximum at 50 % diamond content. The thermally conductive adhesive prepared with etched diamond micropowders exhibits a maximum tensile shear strength of 1.98 MPa and the highest thermal conductivity of 6.32 W·m−1·K−1. Furthermore, the thermal stability was improved, with the adhesive containing 80 % diamond micropowders losing only 2.06 % of its weight when heated from room temperature to 550 °C. Thus, we realize that controlling the content of diamond micropowders yields optimal bonding strength, improved thermal conductivity and excellent thermal stability, showing a greater potential for electronic thermal management.
期刊介绍:
DRM is a leading international journal that publishes new fundamental and applied research on all forms of diamond, the integration of diamond with other advanced materials and development of technologies exploiting diamond. The synthesis, characterization and processing of single crystal diamond, polycrystalline films, nanodiamond powders and heterostructures with other advanced materials are encouraged topics for technical and review articles. In addition to diamond, the journal publishes manuscripts on the synthesis, characterization and application of other related materials including diamond-like carbons, carbon nanotubes, graphene, and boron and carbon nitrides. Articles are sought on the chemical functionalization of diamond and related materials as well as their use in electrochemistry, energy storage and conversion, chemical and biological sensing, imaging, thermal management, photonic and quantum applications, electron emission and electronic devices.
The International Conference on Diamond and Carbon Materials has evolved into the largest and most well attended forum in the field of diamond, providing a forum to showcase the latest results in the science and technology of diamond and other carbon materials such as carbon nanotubes, graphene, and diamond-like carbon. Run annually in association with Diamond and Related Materials the conference provides junior and established researchers the opportunity to exchange the latest results ranging from fundamental physical and chemical concepts to applied research focusing on the next generation carbon-based devices.