{"title":"Behaviour Prediction of Via-Holes Transition Based on Transfer Learning","authors":"Weihong Liu, Yanbo Zhao, Shuai Zhang, Duan Xie, Haoqian Wu","doi":"10.1049/mia2.70035","DOIUrl":null,"url":null,"abstract":"<p>Via-holes transition is an important component in multi-layer microwave and millimetre wave circuit systems, directly affecting signal transmission performance. In order to improve the millimetre wave performance of via-holes transition, the electromagnetic design automation software has been used to optimise the circuits design, which could consume a plenty of computer resources. In recent years, deep neural network (DNN) has been widely applied in the research of microwave component and is expected to solve this challenging and time-consuming problem. Employing large labelled datasets to obtain high-performance DNN model is desired but troublesome. Therefore, a transfer learning with deep neural network (TLDNN) surrogate model is proposed to improve the modelling efficiency. The experimental validation demonstrates that, compared with the conventional DNN, the TLDNN can reduce the amount of training data required without losing accuracy and accelerating modelling speed for behaviour prediction of via-holes transition. A prototype via-holes transition fabricated on multilayer liquid crystal polymer (LCP) substrate exhibits an average S<sub>11</sub> deviation of less than 2.9 dB between the measured and predicted results.</p>","PeriodicalId":13374,"journal":{"name":"Iet Microwaves Antennas & Propagation","volume":"19 1","pages":""},"PeriodicalIF":1.1000,"publicationDate":"2025-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1049/mia2.70035","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Iet Microwaves Antennas & Propagation","FirstCategoryId":"94","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/mia2.70035","RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Via-holes transition is an important component in multi-layer microwave and millimetre wave circuit systems, directly affecting signal transmission performance. In order to improve the millimetre wave performance of via-holes transition, the electromagnetic design automation software has been used to optimise the circuits design, which could consume a plenty of computer resources. In recent years, deep neural network (DNN) has been widely applied in the research of microwave component and is expected to solve this challenging and time-consuming problem. Employing large labelled datasets to obtain high-performance DNN model is desired but troublesome. Therefore, a transfer learning with deep neural network (TLDNN) surrogate model is proposed to improve the modelling efficiency. The experimental validation demonstrates that, compared with the conventional DNN, the TLDNN can reduce the amount of training data required without losing accuracy and accelerating modelling speed for behaviour prediction of via-holes transition. A prototype via-holes transition fabricated on multilayer liquid crystal polymer (LCP) substrate exhibits an average S11 deviation of less than 2.9 dB between the measured and predicted results.
期刊介绍:
Topics include, but are not limited to:
Microwave circuits including RF, microwave and millimetre-wave amplifiers, oscillators, switches, mixers and other components implemented in monolithic, hybrid, multi-chip module and other technologies. Papers on passive components may describe transmission-line and waveguide components, including filters, multiplexers, resonators, ferrite and garnet devices. For applications, papers can describe microwave sub-systems for use in communications, radar, aerospace, instrumentation, industrial and medical applications. Microwave linear and non-linear measurement techniques.
Antenna topics including designed and prototyped antennas for operation at all frequencies; multiband antennas, antenna measurement techniques and systems, antenna analysis and design, aperture antenna arrays, adaptive antennas, printed and wire antennas, microstrip, reconfigurable, conformal and integrated antennas.
Computational electromagnetics and synthesis of antenna structures including phased arrays and antenna design algorithms.
Radiowave propagation at all frequencies and environments.
Current Special Issue. Call for papers:
Metrology for 5G Technologies - https://digital-library.theiet.org/files/IET_MAP_CFP_M5GT_SI2.pdf