Behaviour Prediction of Via-Holes Transition Based on Transfer Learning

IF 1.1 4区 计算机科学 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Weihong Liu, Yanbo Zhao, Shuai Zhang, Duan Xie, Haoqian Wu
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引用次数: 0

Abstract

Via-holes transition is an important component in multi-layer microwave and millimetre wave circuit systems, directly affecting signal transmission performance. In order to improve the millimetre wave performance of via-holes transition, the electromagnetic design automation software has been used to optimise the circuits design, which could consume a plenty of computer resources. In recent years, deep neural network (DNN) has been widely applied in the research of microwave component and is expected to solve this challenging and time-consuming problem. Employing large labelled datasets to obtain high-performance DNN model is desired but troublesome. Therefore, a transfer learning with deep neural network (TLDNN) surrogate model is proposed to improve the modelling efficiency. The experimental validation demonstrates that, compared with the conventional DNN, the TLDNN can reduce the amount of training data required without losing accuracy and accelerating modelling speed for behaviour prediction of via-holes transition. A prototype via-holes transition fabricated on multilayer liquid crystal polymer (LCP) substrate exhibits an average S11 deviation of less than 2.9 dB between the measured and predicted results.

Abstract Image

基于迁移学习的过孔迁移行为预测
过孔转换是多层微波和毫米波电路系统中的重要组成部分,直接影响信号的传输性能。为了提高过孔转换的毫米波性能,利用电磁设计自动化软件对电路进行优化设计,这将消耗大量的计算机资源。近年来,深度神经网络(DNN)在微波元件的研究中得到了广泛的应用,有望解决这一具有挑战性和耗时的问题。利用大型标记数据集来获得高性能的深度神经网络模型是一种理想的方法,但存在一些问题。为此,提出一种基于深度神经网络(TLDNN)的迁移学习代理模型,以提高建模效率。实验验证表明,与传统深度神经网络相比,TLDNN可以在不损失精度的情况下减少所需的训练数据量,并加快过孔过渡行为预测的建模速度。在多层液晶聚合物(LCP)衬底上制备的原型过孔跃迁的测量结果与预测结果之间的平均S11偏差小于2.9 dB。
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来源期刊
Iet Microwaves Antennas & Propagation
Iet Microwaves Antennas & Propagation 工程技术-电信学
CiteScore
4.30
自引率
5.90%
发文量
109
审稿时长
7 months
期刊介绍: Topics include, but are not limited to: Microwave circuits including RF, microwave and millimetre-wave amplifiers, oscillators, switches, mixers and other components implemented in monolithic, hybrid, multi-chip module and other technologies. Papers on passive components may describe transmission-line and waveguide components, including filters, multiplexers, resonators, ferrite and garnet devices. For applications, papers can describe microwave sub-systems for use in communications, radar, aerospace, instrumentation, industrial and medical applications. Microwave linear and non-linear measurement techniques. Antenna topics including designed and prototyped antennas for operation at all frequencies; multiband antennas, antenna measurement techniques and systems, antenna analysis and design, aperture antenna arrays, adaptive antennas, printed and wire antennas, microstrip, reconfigurable, conformal and integrated antennas. Computational electromagnetics and synthesis of antenna structures including phased arrays and antenna design algorithms. Radiowave propagation at all frequencies and environments. Current Special Issue. Call for papers: Metrology for 5G Technologies - https://digital-library.theiet.org/files/IET_MAP_CFP_M5GT_SI2.pdf
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