A flexible graphene-aluminum composite thermal strap with high thermal conductivity: two-step vacuum welding process optimization and interfacial microstructure control
IF 3.9 2区 材料科学Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
{"title":"A flexible graphene-aluminum composite thermal strap with high thermal conductivity: two-step vacuum welding process optimization and interfacial microstructure control","authors":"Yajia Liu, Fei Teng, Baosheng Zhang, Chenxiang Liu, Yue Wu, Shuhai Chen, Jian Yang, Jihua Huang","doi":"10.1016/j.vacuum.2025.114500","DOIUrl":null,"url":null,"abstract":"<div><div>The joining of graphene and metal to prepare a thermal strap is an effective method to enhance the heat dissipation capability of high heat-generating devices in spacecraft applications. A two-step vacuum welding method was employed to fabricate the flexible graphene-aluminum composite thermal strap. Firstly, multi sheets graphene films were brazed using AgCu4.5Ti filler metal, resulting in a typical interfacial microstructure characterized by AgCu4.5Ti/Cu(s,s) + Ag(s,s)/TiC/graphene. In addition, by studying the capillary filling behavior of AgCu4.5Ti between graphene films under various brazing temperatures and time, a reliable AgCu4.5Ti/graphene joint was obtained at 1123 K for 10 min. Secondly, the terminal Ni(P)-deposited 6061 aluminum alloy was soldered to the graphene films assembly brazed with AgCu4.5Ti using Sn63Pb37 solder. The interfacial microstructures of the Sn63Pb37/Ni(P)-deposited 6061 aluminum alloy joints transformed from Ni<sub>3</sub>Sn<sub>4</sub>+Ni<sub>3</sub>P to Ni<sub>2</sub>SnP + Ni<sub>2</sub>P with increasing soldering temperature and further transformed to Ni<sub>2</sub>SnP as the soldering time increased. The optimal soldering parameters were identified as 573 K for 10 min. Flexibility and thermal performance analyses demonstrated that the flexible graphene-aluminum composite thermal strap exhibited excellent flexibility and achieved a thermal conductivity of 1345.52 W m<sup>−1</sup> K<sup>−1</sup>.</div></div>","PeriodicalId":23559,"journal":{"name":"Vacuum","volume":"240 ","pages":"Article 114500"},"PeriodicalIF":3.9000,"publicationDate":"2025-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Vacuum","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0042207X25004907","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
The joining of graphene and metal to prepare a thermal strap is an effective method to enhance the heat dissipation capability of high heat-generating devices in spacecraft applications. A two-step vacuum welding method was employed to fabricate the flexible graphene-aluminum composite thermal strap. Firstly, multi sheets graphene films were brazed using AgCu4.5Ti filler metal, resulting in a typical interfacial microstructure characterized by AgCu4.5Ti/Cu(s,s) + Ag(s,s)/TiC/graphene. In addition, by studying the capillary filling behavior of AgCu4.5Ti between graphene films under various brazing temperatures and time, a reliable AgCu4.5Ti/graphene joint was obtained at 1123 K for 10 min. Secondly, the terminal Ni(P)-deposited 6061 aluminum alloy was soldered to the graphene films assembly brazed with AgCu4.5Ti using Sn63Pb37 solder. The interfacial microstructures of the Sn63Pb37/Ni(P)-deposited 6061 aluminum alloy joints transformed from Ni3Sn4+Ni3P to Ni2SnP + Ni2P with increasing soldering temperature and further transformed to Ni2SnP as the soldering time increased. The optimal soldering parameters were identified as 573 K for 10 min. Flexibility and thermal performance analyses demonstrated that the flexible graphene-aluminum composite thermal strap exhibited excellent flexibility and achieved a thermal conductivity of 1345.52 W m−1 K−1.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.