Optimization of thermoelectric power factor in β-Cu2Se thin films through Al doping

IF 5.7 2区材料科学 Q2 CHEMISTRY, PHYSICAL

Surfaces and Interfaces Pub Date : 2025-06-15 DOI:10.1016/j.surfin.2025.106958

Tianbao Chen , Dong Yang , Haobin Li , Qin Liu , Zhaokun Cai , Chaoming Chen , Dongwei Ao , Hongli Ma , Xianghua Zhang

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Abstract

Effective control of charge carriers is crucial for achieving high thermoelectric performance. In this study, β-Cu₂Se (high-temperature phase) thin films were fabricated via in situ magnetron sputtering. The influence of aluminum (Al) doping on the crystal structure, electronic band structure, and carrier transport behavior of β-Cu₂Se was systematically investigated. Al doping was found to modulate the crystal structure, inducing a partial phase transition to the α-Cu₂Se phase. Moreover, Al incorporation can modify the electronic band structure and reduce the carrier concentration in p-type β-Cu₂Se, leading to an increased Seebeck coefficient. Benefiting from the intrinsically high electrical conductivity of β-Cu₂Se and the synergistic effects of Al doping, a maximum power factor of 5.37 μW cm⁻¹ K⁻² at 573 K was achieved at an Al doping level of 3.53 at.%. These results demonstrate the effectiveness of Al doping in enhancing β-Cu₂Se thermoelectric power factor.

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Al掺杂优化β-Cu2Se薄膜热电功率因数

有效控制载流子是实现高热电性能的关键。本研究采用原位磁控溅射法制备了β-Cu2Se（高温相）薄膜。系统研究了铝掺杂对β-Cu2Se晶体结构、电子能带结构和载流子输运行为的影响。Al掺杂可以调节晶体结构，诱导部分相变到α-Cu2Se相。此外，Al的掺入可以改变p型β-Cu2Se的电子能带结构，降低载流子浓度，导致Seebeck系数增大。得益于β-Cu2Se固有的高导电性和Al掺杂的协同效应，当Al掺杂量为3.53 at.%时，在573 K时获得了5.37 μW cm−1 K−2的最大功率因数。这些结果证明了Al掺杂提高β-Cu2Se热电功率因数的有效性。

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来源期刊

Surfaces and Interfaces Chemistry-General Chemistry

CiteScore

8.50

自引率

6.50%

发文量

753

审稿时长

35 days

期刊介绍： The aim of the journal is to provide a respectful outlet for ''sound science'' papers in all research areas on surfaces and interfaces. We define sound science papers as papers that describe new and well-executed research, but that do not necessarily provide brand new insights or are merely a description of research results. Surfaces and Interfaces publishes research papers in all fields of surface science which may not always find the right home on first submission to our Elsevier sister journals (Applied Surface, Surface and Coatings Technology, Thin Solid Films)