150 GHz-Band Compact Phased-Array AiP Module for XR Applications Toward 6G

IF 3.4 0 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE microwave and wireless technology letters Pub Date : 2025-06-04 DOI:10.1109/LMWT.2025.3565729

Yohei Morishita;Ken Takahashi;Ryosuke Hasaba;Akihiro Egami;Tomoki Abe;Masatoshi Suzuki;Tomohiro Murata;Yoichi Nakagawa;Yudai Yamazaki;Sunghwan Park;Takaya Uchino;Chenxin Liu;Jun Sakamaki;Takashi Tomura;Hiroyuki Sakai;Hiroshi Taneda;Kei Murayama;Yoko Nakabayashi;Shinsuke Hara;Issei Watanabe;Akifumi Kasamatsu;Kenichi Okada;Koji Takinami

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引用次数: 0

Abstract

To realize the practical application of sub-THz band wireless communication toward 6G, it is necessary to develop AiP modules with compact size and low cost. This letter discusses the design of a miniaturized AiP module for high-speed wireless communication targeting extended reality (XR) applications in medical operating rooms as an example of 6G use cases. By integrating waveguide antenna array along with a compact divider/combiner within the multilayer substrates, the module achieves a small form factor of

$8.42\times 20.0\times 1.37$

mm while integrating radio frequency integrated circuit (RFIC) and peripheral surface mount components. The measurement shows a data rate of 40 Gb/s at a 3 m distance in the 150 GHz band with an excellent transmission energy efficiency of 35.7 pJ/bit.

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面向6G的XR应用的150ghz频段紧凑型相控阵AiP模块

为了实现面向6G的亚太赫兹频段无线通信的实际应用，有必要开发体积小、成本低的AiP模块。本信函以6G用例为例，讨论了用于医疗手术室扩展现实（XR）应用的高速无线通信的小型化AiP模块的设计。通过在多层基板内集成波导天线阵列和紧凑型分频器/组合器，该模块在集成射频集成电路（RFIC）和外围表面贴装组件的同时，实现了8.42\ × 20.0\ × 1.37$ mm的小尺寸。测量结果表明，在150ghz频段，3 m距离的数据速率为40 Gb/s，传输能量效率为35.7 pJ/bit。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE microwave and wireless technology letters

CiteScore

6.00

自引率

0.00%

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