{"title":"A reconfigurable MRAM PUF with high reliability","authors":"Zesheng Chen , Yuan Zhang , Chaoqun Shen","doi":"10.1016/j.mejo.2025.106745","DOIUrl":null,"url":null,"abstract":"<div><div>Physical unclonable function (PUF) has been increasingly applied in the Internet of Things (IoT) fields due to its high security. With the emergence of novel devices, magnetoresistive random access memory (MRAM)-based PUF technology offers excellent energy efficiency and integration density. However, it falls short in terms of response reliability. To address this issue, in this paper, we propose a high-reliability reconfigurable MRAM PUF. First, we propose a novel reconfigurable PUF cell based on the characteristics of MRAM devices. Then, we introduce a sleep mode to reduce the power consumption of PUF. Moreover, we propose a resistance configuration strategy in conjunction with the configurable features of MRAM, which further enhances reliability without increasing hardware overhead. The design is simulated and tested in the SMIC 40 nm process. Experimental results demonstrate that the proposed PUF has a uniqueness of 50.02% and a uniformity of 49.98%, both of which are close to the ideal values. Finally, the bit error rate (BER) is less than 2.2% under temperatures of −40 <span><math><mo>∼</mo></math></span> 120 °C and voltages of 0.7 <span><math><mo>∼</mo></math></span> 1.4 V, which effectively improves the reliability.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"163 ","pages":"Article 106745"},"PeriodicalIF":1.9000,"publicationDate":"2025-06-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239125001948","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Physical unclonable function (PUF) has been increasingly applied in the Internet of Things (IoT) fields due to its high security. With the emergence of novel devices, magnetoresistive random access memory (MRAM)-based PUF technology offers excellent energy efficiency and integration density. However, it falls short in terms of response reliability. To address this issue, in this paper, we propose a high-reliability reconfigurable MRAM PUF. First, we propose a novel reconfigurable PUF cell based on the characteristics of MRAM devices. Then, we introduce a sleep mode to reduce the power consumption of PUF. Moreover, we propose a resistance configuration strategy in conjunction with the configurable features of MRAM, which further enhances reliability without increasing hardware overhead. The design is simulated and tested in the SMIC 40 nm process. Experimental results demonstrate that the proposed PUF has a uniqueness of 50.02% and a uniformity of 49.98%, both of which are close to the ideal values. Finally, the bit error rate (BER) is less than 2.2% under temperatures of −40 120 °C and voltages of 0.7 1.4 V, which effectively improves the reliability.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.