{"title":"Low-cost 3D-printed mask system for versatile selective sample deposition on in situ TEM chips","authors":"Deema Balalta, Sara Bals","doi":"10.1016/j.ohx.2025.e00663","DOIUrl":null,"url":null,"abstract":"<div><div><em>In situ</em> liquid electron microscopy has emerged as a powerful technique for studying dynamic processes at the nanoscale. However, selective deposition of samples on <em>in situ</em> biasing MEMS chips is far from straightforward due to the relatively small area of the electron-transparent window and the compact design of the three electrodes. This is particularly challenging for samples dispersed in solvents or those fabricated through physical vapor deposition. Here, we address these challenges by proposing a simple, low-cost, 3D-printed loading stage with an integrated mask system. Our design enables controlled deposition, as demonstrated by the successful deposition of AuPdPt nanoparticles from liquid suspension, sputtered Au clusters, and a cluster-based Au thin film onto the working electrode. The design can be easily fabricated in any electron microscopy lab, making it accessible and adaptable to various MEMS <em>in situ</em> chips and sample types.</div></div>","PeriodicalId":37503,"journal":{"name":"HardwareX","volume":"23 ","pages":"Article e00663"},"PeriodicalIF":2.1000,"publicationDate":"2025-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"HardwareX","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2468067225000410","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In situ liquid electron microscopy has emerged as a powerful technique for studying dynamic processes at the nanoscale. However, selective deposition of samples on in situ biasing MEMS chips is far from straightforward due to the relatively small area of the electron-transparent window and the compact design of the three electrodes. This is particularly challenging for samples dispersed in solvents or those fabricated through physical vapor deposition. Here, we address these challenges by proposing a simple, low-cost, 3D-printed loading stage with an integrated mask system. Our design enables controlled deposition, as demonstrated by the successful deposition of AuPdPt nanoparticles from liquid suspension, sputtered Au clusters, and a cluster-based Au thin film onto the working electrode. The design can be easily fabricated in any electron microscopy lab, making it accessible and adaptable to various MEMS in situ chips and sample types.
HardwareXEngineering-Industrial and Manufacturing Engineering
CiteScore
4.10
自引率
18.20%
发文量
124
审稿时长
24 weeks
期刊介绍:
HardwareX is an open access journal established to promote free and open source designing, building and customizing of scientific infrastructure (hardware). HardwareX aims to recognize researchers for the time and effort in developing scientific infrastructure while providing end-users with sufficient information to replicate and validate the advances presented. HardwareX is open to input from all scientific, technological and medical disciplines. Scientific infrastructure will be interpreted in the broadest sense. Including hardware modifications to existing infrastructure, sensors and tools that perform measurements and other functions outside of the traditional lab setting (such as wearables, air/water quality sensors, and low cost alternatives to existing tools), and the creation of wholly new tools for either standard or novel laboratory tasks. Authors are encouraged to submit hardware developments that address all aspects of science, not only the final measurement, for example, enhancements in sample preparation and handling, user safety, and quality control. The use of distributed digital manufacturing strategies (e.g. 3-D printing) is encouraged. All designs must be submitted under an open hardware license.