High-strength mechanically gradient hydrogels via physical crosslinking for tendon-mimetic tissue repair

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
He Zhu, Cheng Wang, Yican Yang, Hongwei Ma, Xiaoli Fan, Yang Zhang, Ziyi Dai, Rong Cai, Kai Qian
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引用次数: 0

Abstract

The biomimetic materials that replicate the mechanical gradient transitions from muscle to tendon to bone remain a significant challenge in tissue engineering, particularly through simple and environmentally friendly approaches. This mechanical gradient is crucial for applications such as rotator cuff and Achilles tendon repair patches, which prevent stress shielding and ensure uniform stress distribution, addressing the stress concentration issues common in traditional repairs. Here, we present a strategy that achieves high strength even at high water content, enabling programmable modulus/structural gradients with broad applicability. Using rotator cuff tendon repair as a model system, we demonstrate successful in vivo tissue regeneration with integrated real-time sensing capabilities, providing quantitative data for rehabilitation protocols. The hydrogels exhibit precisely controlled regional mechanical properties and seamless interface transitions, mimicking the hierarchical structure of native tissue. This approach not only improves healing outcomes compared to conventional methods but also establishes a quantitative standard for rehabilitation training.

Abstract Image

通过物理交联的高强度机械梯度水凝胶用于模拟肌腱组织修复
复制从肌肉到肌腱到骨骼的机械梯度转变的仿生材料在组织工程中仍然是一个重大挑战,特别是通过简单和环保的方法。这种机械梯度对于肩袖和跟腱修复贴片等应用至关重要,它可以防止应力屏蔽,确保均匀的应力分布,解决传统修复中常见的应力集中问题。在这里,我们提出了一种策略,即使在高含水量下也能实现高强度,使可编程的模量/结构梯度具有广泛的适用性。使用肩袖肌腱修复作为模型系统,我们展示了具有集成实时传感能力的成功体内组织再生,为康复方案提供了定量数据。水凝胶表现出精确控制的区域力学性能和无缝的界面转变,模仿天然组织的分层结构。与传统方法相比,该方法不仅提高了愈合效果,而且为康复训练建立了定量标准。
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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