Tuning the rheology of copper pastes with reliable printability and enhanced storage stability

IF 5.5 3区工程技术 Q1 ENGINEERING, CHEMICAL

Journal of the Taiwan Institute of Chemical Engineers Pub Date : 2025-06-06 DOI:10.1016/j.jtice.2025.106222

Chunyu Chen , Jiayi Zhu , Zhihao Chen , Qi Jiang , Huidan Zeng

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引用次数: 0

Abstract

Background

Copper pastes have garnered significant attention due to high conductivity and cost-effectiveness versus precious metal pastes. However, unresolved problems like the formation of film collapse, flying ink, burrs and stencil clogging are often caused by their uncontrollable rheological properties during the screen-printing process.

Methods

The acrylic resin content in the copper pastes was adjusted to achieve suitable rheological properties of the pastes, such as pseudoplasticity, thixotropy, and yield stress, and further improve printability and long-term storage performance. Significant findings The copper films with 15 wt % acrylic resin content exhibited optimal sintering densification, minimal porosity, 38 % sintering shrinkage, and ultra-low sheet resistance of 3.85 mΩ/sq. This technique enables scalable formulating multicomponent copper electronic pastes with tunable rheological properties for printed circuit applications.

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调整铜浆的流变性，具有可靠的印刷性和增强的存储稳定性

铜膏体与贵金属膏体相比，具有高导电性和成本效益，因此受到了广泛关注。然而，丝网印刷过程中，由于其不可控的流变特性，往往会造成薄膜坍塌、飞墨、毛刺和模板堵塞等尚未解决的问题。方法通过调整铜膏体中丙烯酸树脂的含量，使铜膏体具有合适的假塑性、触变性和屈服应力等流变性能，进一步提高铜膏体的印刷性能和长期储存性能。丙烯酸树脂含量为15 wt %的铜膜具有最佳的烧结致密性、最小的孔隙率、38%的烧结收缩率和3.85 mΩ/sq的超低片材电阻。该技术使可扩展配方多组分铜电子浆料具有可调的流变性能，适用于印刷电路应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of the Taiwan Institute of Chemical Engineers 工程技术-工程：化工

CiteScore

9.10

自引率

14.00%

发文量

362

审稿时长

35 days

期刊介绍： Journal of the Taiwan Institute of Chemical Engineers (formerly known as Journal of the Chinese Institute of Chemical Engineers) publishes original works, from fundamental principles to practical applications, in the broad field of chemical engineering with special focus on three aspects: Chemical and Biomolecular Science and Technology, Energy and Environmental Science and Technology, and Materials Science and Technology. Authors should choose for their manuscript an appropriate aspect section and a few related classifications when submitting to the journal online.