A soft-clamped topological waveguide for phonons

Abstract

Topological insulators were originally discovered for electron waves in condensed-matter systems. Recently, this concept has been transferred to bosonic systems such as photons¹ and phonons², which propagate in materials patterned with artificial lattices that emulate spin-Hall physics. This work has been motivated, in part, by the prospect of topologically protected transport along edge channels in on-chip circuits^2,3. In principle, topology protects propagation against backscattering, but not against loss, which has remained limited to the dB cm⁻¹ level for phononic waveguides, whether topological^4,5,6,7 or not^{8,9,10,11,12,13,14,15,16,17,18,19}. Here we combine advanced dissipation engineering²⁰—in particular, the recently introduced method of soft clamping²¹—with the concept of valley-Hall topological insulators for phonons^{22,23,24,25,26}. This enables on-chip phononic waveguides with propagation losses due to dissipation of 3 dB km⁻¹ at room temperature, orders of magnitude below any previous chip-scale devices. The low losses also allow us to accurately quantify backscattering protection in topological phononic waveguides, using high-resolution ultrasound spectroscopy. We infer that phonons follow a sharp, 120° bend with a 99.99% probability instead of being scattered back, and less than one phonon in a million is lost. Our work will inspire new research directions on ultralow-loss phononic waveguides and will provide a clean bosonic system for investigating topological protection and non-Hermitian topological physics.