Effect of Hole Diameter on the Fatigue Life and Failure Mechanism of Riveted Joints With Different Squeeze Forces

IF 3.2 2区 材料科学 Q2 ENGINEERING, MECHANICAL
Ming Li, Pengcheng Li, Wei Tian, Junshan Hu, Changrui Wang, Wenhe Liao
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引用次数: 0

Abstract

Riveting is a reliable joining process that is widely used in aircraft assembly, where axial loads can be transferred from one sheet to another through the load transfer action of rivets. In this article, the effects of hole diameter and squeeze force on the fatigue behavior of riveted joints were systematically researched. The results demonstrated that the hole diameter and squeeze force had great effects on the interference fit size and the interface contact state between the rivet and the hole, thereby affecting the fatigue properties. The fatigue life shortens as the initial hole diameter increases. The greater the squeeze force, the higher the fatigue life. With the increase of the initial hole diameter, the decreased degree of fatigue life is larger with the lower squeeze force. In addition, the fretting wear behavior was generated during the fatigue loading process. Two failure modes of outer sheet fracture and mixed fracture occurred in riveted joints.

不同挤压力下孔直径对铆接接头疲劳寿命的影响及失效机理
铆接是一种可靠的连接工艺,广泛应用于飞机装配,其中轴向载荷可以通过铆钉的载荷传递作用从一个板转移到另一个板。本文系统地研究了孔直径和挤压力对铆接接头疲劳性能的影响。结果表明:孔直径和挤压力对过盈配合尺寸和铆钉与孔的界面接触状态有较大影响,从而影响其疲劳性能;随着初始孔径的增大,疲劳寿命缩短。挤压力越大,疲劳寿命越高。随着初始孔径的增大,挤压力越小,疲劳寿命的下降程度越大。此外,疲劳加载过程中还产生了微动磨损行为。铆接接头存在外板断裂和混合断裂两种破坏模式。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
6.30
自引率
18.90%
发文量
256
审稿时长
4 months
期刊介绍: Fatigue & Fracture of Engineering Materials & Structures (FFEMS) encompasses the broad topic of structural integrity which is founded on the mechanics of fatigue and fracture, and is concerned with the reliability and effectiveness of various materials and structural components of any scale or geometry. The editors publish original contributions that will stimulate the intellectual innovation that generates elegant, effective and economic engineering designs. The journal is interdisciplinary and includes papers from scientists and engineers in the fields of materials science, mechanics, physics, chemistry, etc.
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