Space Charge Characteristics of Silicone Gel for Power Module Encapsulation at High Temperatures

IF 2.9 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zepeng Lv;Xinyue Zhang;Bingjie Wang;Jinyang Peng;Chen Zhang;Kai Wu;Yonghong Cheng
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Abstract

With the advancement of power modules toward high voltage and high power, the encapsulation reliability faced by power modules has attracted great attention under increasing electrical stress and thermal stress. Silicone gel is prevailing for encapsulation with excellent electrical properties. Subjected to direct current (dc) voltages, space charge accumulation will cause local electric field distortion and partial discharge. Thus, it is the intention of this article to study space charge accumulation and breakdown characteristics of silicone gel at high temperatures. Based on the pulsed electroacoustic (PEA) method, experiments are carried out to obtain space charge distribution at high temperatures and homocharge is found to accumulate in silicone gel. The electrical performance is also characterized and analyzed by systematic dc tests. Temperature plays an important role in affecting insulation properties of silicone gel, causing a decrease in breakdown field and an enhancement in dc conductivity. Analyses show that the decrease in dc breakdown strength of silicone gel attributes to two reasons. For one thing, the intensification of charge injection leads to an overall increase in distortion rate of partial electric field. For another, the shallow traps are dominant in silicone gel and the molecular chains show high activity on the freedom volume as temperature rises. The measurement and analysis will provide references for further application of silicone gel in power module encapsulation.
高温下功率模块封装用硅凝胶的空间电荷特性研究
随着电源模块向高压、大功率方向发展,在电应力和热应力不断增大的情况下,电源模块所面临的封装可靠性问题备受关注。硅凝胶具有优异的电性能,是目前普遍采用的封装材料。在直流电压作用下,空间电荷积累会引起局部电场畸变和局部放电。因此,本文的目的是研究有机硅凝胶在高温下的空间电荷积累和击穿特性。基于脉冲电声(PEA)方法,进行了高温下空间电荷分布的实验,发现硅凝胶中有同电荷积聚。通过系统的直流试验对其电性能进行了表征和分析。温度对硅凝胶的绝缘性能有重要影响,导致击穿场的减小和直流导电性的增强。分析表明,硅凝胶直流击穿强度的下降有两个原因。一方面,电荷注入的增强导致局部电场畸变率整体增大。另一方面,随着温度的升高,分子链在自由体积上表现出较高的活性。测试和分析将为硅凝胶在电源模块封装中的进一步应用提供参考。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Dielectrics and Electrical Insulation
IEEE Transactions on Dielectrics and Electrical Insulation 工程技术-工程:电子与电气
CiteScore
6.00
自引率
22.60%
发文量
309
审稿时长
5.2 months
期刊介绍: Topics that are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition of use.
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