UHF Detection of the Eroding DC Dry-Band Arcing on Silicone Rubber Insulation

IF 2.9 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Basharat Mehmood;Refat Atef Ghunem;Ayman El-Hag;Li-Lin Tay
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引用次数: 0

Abstract

This article proposes ultra-high frequency (UHF) detection of the eroding dry-band arcing as a non-intrusive and online detection technique of erosion failure during the dc inclined plane test (IPT). Tests are performed on silicone rubber (SR) composites, while conducting leakage current (LC), surface temperature, and UHF measurements using a horn antenna. No UHF detection is evident during mild dry-band arcing (DBA), which does not lead to erosion. Whereas, the detection is evident during stable DBA, particularly when the intensity becomes remarkable. Thermogravimetry, differential thermal analysis, and Fourier Transform spectroscopy are conducted to elucidate temperature measurements and visual observations. The eroding DBA is shown to lead to depolymerization of SR at $400~^{\circ }$ C, thereby leading to combustion and erosion failure, and stimulating a radical-based crosslinking reaction at temperatures exceeding $500~^{\circ }$ C. The intensity of the UHF detection is also shown to be sensitive to the severity of the eroding DBA as it increases with time during the test or with higher applied test voltages.
硅橡胶绝缘腐蚀直流干带电弧的超高频检测
本文提出了利用超高频(UHF)对侵蚀干带电弧进行检测,作为直流斜面试验(IPT)中侵蚀失效的非侵入式在线检测技术。测试在硅橡胶(SR)复合材料上进行,同时使用喇叭天线进行泄漏电流(LC),表面温度和UHF测量。在轻度干带电弧(DBA)期间,没有明显的UHF检测,这不会导致腐蚀。然而,在稳定的DBA期间,特别是当强度变得显著时,检测是明显的。热重法、差热分析和傅立叶变换光谱法用于阐明温度测量和视觉观察。结果表明,腐蚀DBA在400~^{\circ}$ C时导致SR解聚,从而导致燃烧和腐蚀失效,并在超过500~^{\circ}$ C时刺激自由基基交联反应。UHF检测强度对腐蚀DBA的严重程度也很敏感,因为它在测试期间随着时间的推移或随着较高的测试电压而增加。
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来源期刊
IEEE Transactions on Dielectrics and Electrical Insulation
IEEE Transactions on Dielectrics and Electrical Insulation 工程技术-工程:电子与电气
CiteScore
6.00
自引率
22.60%
发文量
309
审稿时长
5.2 months
期刊介绍: Topics that are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition of use.
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