Unconventional Thermal Stability of Domain Framework in Ferroelectric CuInP2S6

IF 8.3 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Lei Yang, Yun-Zhe Zheng, Abliz Mattursun, Ya-Qiong Wang, Zhao Guan, Rong Huang, Yan Cheng, Bin-Bin Chen, Ping-Hua Xiang, Chun-Gang Duan, Ni Zhong
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Abstract

Achieving stable and persistent polarization characteristics in ferroelectric (FE) materials is crucial for fabricating high-density, low-power multifunctional memories. In this study, we conducted a comprehensive investigation of the 2D FE material CuInP2S6 (CIPS), employing piezoelectric force microscopy (PFM), scanning transmission electron microscopy (STEM), and Raman spectroscopy. By comparing CIPS with and without the nonferroelectric (NFE) phase, we observed unexpected stability of the domain framework at high temperatures. This was evidenced by in situ temperature-dependent PFM measurements and Raman spectra. STEM analysis revealed Cu ion defects and charge accumulation at the FE/NFE interface, which contributed to the thermal stability due to a strong pinning effect. This work highlights the significant positive impact of NFE phases on the thermal stability of FE CIPS, providing insights into the development of controllable FE polarization switching and the potential application of highly reliable and durable multifunctional devices.

Abstract Image

铁电CuInP2S6结构的非常规热稳定性
在铁电(FE)材料中实现稳定和持久的极化特性是制造高密度、低功耗多功能存储器的关键。在本研究中,我们采用压电力显微镜(PFM)、扫描透射电子显微镜(STEM)和拉曼光谱对二维FE材料CuInP2S6 (CIPS)进行了全面的研究。通过比较非铁电相(NFE)和非铁电相的CIPS,我们观察到意想不到的高温下域框架的稳定性。这是由原位温度相关的PFM测量和拉曼光谱证明的。STEM分析显示,FE/NFE界面处存在Cu离子缺陷和电荷积累,这是由于强钉钉效应导致的热稳定性。这项工作强调了NFE相对FE CIPS热稳定性的显著积极影响,为可控FE极化开关的发展以及高可靠和耐用多功能器件的潜在应用提供了见解。
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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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