Chip-Level Packaged Electrochemical Angular Accelerometer With a Wide Measurement Range

Abstract

This article presents a novel approach to realize an electrochemical angular accelerometer with a compact size and a wide measurement range. For the first time, anodic bonding technology was utilized to create a chip-level packaged MEMS electrochemical angular accelerometer with a compact glass-silicon–glass triple layer structure, consisting primarily of a silicon-on-glass (SOG) wafer for angular acceleration sensitivities and a glass cap to form a toroid microchannel. To realize a wide range of angular acceleration measurements, the novel asymmetric planar electrodes with expanded cathode width and intercathode space were deployed on the silicon layer of the SOG wafer to improve the ion reaction of the cathodes more thoroughly. Besides, a narrower flow channel structure was achieved through the glass cap with a cavity to increase flow resistance. Testing results indicated that it has a more comprehensive measurement range (up to 500°/s ${}^{{2}}$ ) and a much higher dynamic range (−130 dB @ 1 Hz), marking a notable advance over its previously reported equivalents. This study presents an innovative method for creating electrochemical angular accelerometers, which are specifically designed to measure rotational motion with substantial angle variations.