Near-Field Semiconductor Imaging and Classification Enabled by Signal Cancellation Using Truncated mm-Wave Silicon Waveguide

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Yuma Kawamoto;Daniel C. Gallego;Alejandro Rivera-Lavado;Tadao Nagatsuma;Michael Nagel;Daniel Headland;Guillermo Carpintero
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Abstract

We demonstrate that a straightforward truncated silicon dielectric waveguide serves as an effective millimeter-wave (mm-wave) near-field semiconductor imaging sensor. The strong localization of modal fields at the truncated silicon tip interface results in fine resolution below the diffraction limit. It is found that, at a specific probing distance, high conductance of a metallized sample exhibits lower reflection than bare silicon substrate due to the signal cancellation with the reflection generated from the significant mismatch at the truncated interface. We experimentally validate that this cancellation effect is dependent upon conductivity and it allows us to differentiate multiple levels of conductivity. With this technique, we achieve the resolution of ~1/ $3~\lambda _{{0}}$ and a high image contrast of ~20 dB between conductors and the bare silicon substrate. In addition, a cancellation effect is employed that allows for accurate calibration of working distance, providing stable responses across the scanning area. We demonstrate how this effect can be exploited for high-accuracy material classification with broadband spectral correlation analysis enabled by the silicon sensor. The proposed method can be easily incorporated with integrated all-silicon circuits, showing promise for cost-effective, compact imaging modules, which is highly beneficial for real-world deployment in the industry.
截断毫米波硅波导信号对消实现近场半导体成像与分类
我们证明了一个直接截断的硅介质波导作为一个有效的毫米波(mm波)近场半导体成像传感器。截断硅尖端界面处模态场的强局域化导致了低于衍射极限的精细分辨率。研究发现,在特定探测距离下,高电导金属化样品的反射比裸硅衬底低,这是由于信号与截断界面处明显不匹配产生的反射相抵消。我们通过实验验证了这种抵消效应取决于电导率,它允许我们区分多个电导率水平。利用这种技术,我们实现了~1/ $3~\lambda _{{0}}$的分辨率和导体与裸硅衬底之间~20 dB的高图像对比度。此外,采用抵消效应,可以精确校准工作距离,在整个扫描区域提供稳定的响应。我们展示了这种效应如何利用硅传感器实现的宽带光谱相关分析进行高精度材料分类。所提出的方法可以很容易地与集成全硅电路相结合,显示出具有成本效益的紧凑成像模块的前景,这对实际工业部署非常有益。
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来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
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