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{"title":"Synthesis and characterization of tough colorless poly(amide-imide)s containing cyclohexanedicarbonyl chloride with different trans:cis ratios","authors":"Jinglei Xing, Lei Yang, Tianci Ma, Guofei Chen","doi":"10.1002/pi.6750","DOIUrl":null,"url":null,"abstract":"<p>With the rapid development of flexible optoelectronic devices, colorless polyimide films with excellent comprehensive performance have received widespread attention. In this work, a series of poly(amide-imide)s (PAIs) were synthesized by copolymerization of 4,4′-(hexafluoroisopropylidene)diphthalic anhydride, 1,4-cyclohexanedicarbonyl chloride (CHDC) and 2,2′-bis(trifluoromethyl)benzidine. The thermal dimensional stability and mechanical properties of the PAI films were improved due to the introduction of rigid rod-like amide bonds in the polymer chain. In addition, the PAIs with more <i>trans</i>-CHDC content showed higher glass transition temperature (<i>T</i><sub>g</sub>) and lower coefficient of thermal expansion (CTE). At the same time, the cooperative conformational transitions of cyclohexane rings in <i>trans</i>-CHDC promoted molecular chain slip and improved the film toughness. Moreover, with the introduction of the cyclohexane moiety, these PAIs had excellent optical transparency and solubility. In particular, PAI-6 exhibited high <i>T</i><sub>g</sub> of 364 °C, low CTE of 29.8 ppm K<sup>−1</sup>, high transmittance of 87% at 400 nm, tensile modulus of 3.6 GPa and elongation at break of 9.7%. Therefore, the incorporation of cyclohexane structures and amide bonds into the main chain through copolymerization with CHDC provided a simple method for the synthesis of tough colorless PAIs with excellent comprehensive properties. © 2025 Society of Chemical Industry.</p>","PeriodicalId":20404,"journal":{"name":"Polymer International","volume":"74 7","pages":"583-592"},"PeriodicalIF":2.9000,"publicationDate":"2025-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer International","FirstCategoryId":"92","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/pi.6750","RegionNum":4,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
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Abstract
With the rapid development of flexible optoelectronic devices, colorless polyimide films with excellent comprehensive performance have received widespread attention. In this work, a series of poly(amide-imide)s (PAIs) were synthesized by copolymerization of 4,4′-(hexafluoroisopropylidene)diphthalic anhydride, 1,4-cyclohexanedicarbonyl chloride (CHDC) and 2,2′-bis(trifluoromethyl)benzidine. The thermal dimensional stability and mechanical properties of the PAI films were improved due to the introduction of rigid rod-like amide bonds in the polymer chain. In addition, the PAIs with more trans -CHDC content showed higher glass transition temperature (T g ) and lower coefficient of thermal expansion (CTE). At the same time, the cooperative conformational transitions of cyclohexane rings in trans -CHDC promoted molecular chain slip and improved the film toughness. Moreover, with the introduction of the cyclohexane moiety, these PAIs had excellent optical transparency and solubility. In particular, PAI-6 exhibited high T g of 364 °C, low CTE of 29.8 ppm K−1 , high transmittance of 87% at 400 nm, tensile modulus of 3.6 GPa and elongation at break of 9.7%. Therefore, the incorporation of cyclohexane structures and amide bonds into the main chain through copolymerization with CHDC provided a simple method for the synthesis of tough colorless PAIs with excellent comprehensive properties. © 2025 Society of Chemical Industry.
含不同反顺比环己二羰基氯坚韧无色聚酰胺-亚胺的合成与表征
随着柔性光电器件的快速发展,综合性能优异的无色聚酰亚胺薄膜受到了广泛的关注。以4,4′-(六氟异丙基)二苯二酸酐、1,4-环己二羰基氯(CHDC)和2,2′-双(三氟甲基)联苯胺为原料,共聚合成了一系列聚酰胺-亚胺(PAIs)。由于在聚合物链中引入了刚性的棒状酰胺键,PAI薄膜的热尺寸稳定性和机械性能得到了改善。此外,反式chdc含量高的PAIs具有较高的玻璃化转变温度(Tg)和较低的热膨胀系数(CTE)。同时,环己烷环在反式chdc中的协同构象转变促进了分子链的滑移,提高了薄膜的韧性。此外,随着环己烷部分的引入,这些PAIs具有优异的光学透明度和溶解性。特别是PAI-6具有364℃的高Tg、29.8 ppm K−1的低CTE、高达87%的400 nm透光率、3.6 GPa的拉伸模量和9.7%的断裂伸长率。因此,通过与CHDC共聚,将环己烷结构和酰胺键引入主链,为合成综合性能优异的坚硬无色PAIs提供了一种简便的方法。©2025化学工业协会。
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