{"title":"Reaction bonding of oxide/oxide ceramic matrix composites using aluminum nitride as an alumina precursor","authors":"Fucai Yang, Xinqiang Cao, Yang Liu, Wenfeng Qiu","doi":"10.1111/ijac.15145","DOIUrl":null,"url":null,"abstract":"<p>The reaction bonding technique offers a promising approach for controlling matrix sintering shrinkage in oxide/oxide ceramic matrix composites (OCMCs), thereby reducing the sintering cracks and enhancing mechanical properties. In this study, aluminum nitride (AlN) was used as an alumina precursor to fabricate OCMCs via reaction bonding. The results indicated that the mechanical properties of the OCMCs could be greatly improved due to the volume expansion induced by AlN oxidation, which reduced sintering cracks, and the high sintering activity of AlN, which enhanced the particle bonding strength in the matrix. However, the strong bonding between the matrix and fibers, attributed to the high sintering activity of AlN, resulted in the decrease of toughness. These findings confirm that the reaction bonding can effectively improve the mechanical properties of OCMCs, but careful control of matrix-fiber bonding is essential to optimize overall performance.</p>","PeriodicalId":13903,"journal":{"name":"International Journal of Applied Ceramic Technology","volume":"22 4","pages":""},"PeriodicalIF":2.3000,"publicationDate":"2025-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Applied Ceramic Technology","FirstCategoryId":"88","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1111/ijac.15145","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
引用次数: 0
Abstract
The reaction bonding technique offers a promising approach for controlling matrix sintering shrinkage in oxide/oxide ceramic matrix composites (OCMCs), thereby reducing the sintering cracks and enhancing mechanical properties. In this study, aluminum nitride (AlN) was used as an alumina precursor to fabricate OCMCs via reaction bonding. The results indicated that the mechanical properties of the OCMCs could be greatly improved due to the volume expansion induced by AlN oxidation, which reduced sintering cracks, and the high sintering activity of AlN, which enhanced the particle bonding strength in the matrix. However, the strong bonding between the matrix and fibers, attributed to the high sintering activity of AlN, resulted in the decrease of toughness. These findings confirm that the reaction bonding can effectively improve the mechanical properties of OCMCs, but careful control of matrix-fiber bonding is essential to optimize overall performance.
期刊介绍:
The International Journal of Applied Ceramic Technology publishes cutting edge applied research and development work focused on commercialization of engineered ceramics, products and processes. The publication also explores the barriers to commercialization, design and testing, environmental health issues, international standardization activities, databases, and cost models. Designed to get high quality information to end-users quickly, the peer process is led by an editorial board of experts from industry, government, and universities. Each issue focuses on a high-interest, high-impact topic plus includes a range of papers detailing applications of ceramics. Papers on all aspects of applied ceramics are welcome including those in the following areas:
Nanotechnology applications;
Ceramic Armor;
Ceramic and Technology for Energy Applications (e.g., Fuel Cells, Batteries, Solar, Thermoelectric, and HT Superconductors);
Ceramic Matrix Composites;
Functional Materials;
Thermal and Environmental Barrier Coatings;
Bioceramic Applications;
Green Manufacturing;
Ceramic Processing;
Glass Technology;
Fiber optics;
Ceramics in Environmental Applications;
Ceramics in Electronic, Photonic and Magnetic Applications;