A novel minimized millimeter-wave on-chip spoof surface plasmon polariton and its applications based on IPD technology

IF 1.9 3区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Journal Pub Date : 2025-05-29 DOI:10.1016/j.mejo.2025.106755

Yuyang Zeng, Yongle Wu, Yuhao Yang, Leidan Pan, Weimin Wang

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引用次数: 0

Abstract

In this paper, a novel structure for spoof surface plasmon polariton (SSPP) is proposed, enabling chip-scale millimeter-wave SSPP with compact dimensions. This structure allows the equivalent surface plasmon frequency to be flexibly adjusted without increasing lateral dimensions, making it suitable for on-chip millimeter-wave passive device designs and interconnections. Compared to conventional SSPP designs, the proposed structure significantly reduces on-chip area while maintaining excellent electromagnetic performance. Leveraging these characteristics, several on-chip implementations have been developed using integrated passive device (IPD) technology, including SSPP transmission lines, coupled lines, and an SSPP-based millimeter-wave Wilkinson power divider featuring a wideband, flat power division ratio. The dispersion curves and S-parameters of the proposed SSPP designs were simulated and measured, validating their feasibility for on-chip integration.

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一种新的最小化毫米波片上欺骗表面等离子激元及其基于IPD技术的应用

本文提出了一种新的欺骗表面等离子激元（SSPP）结构，实现了尺寸紧凑的芯片级毫米波SSPP。这种结构允许在不增加横向尺寸的情况下灵活调整等效表面等离子体频率，使其适用于片上毫米波无源器件设计和互连。与传统的SSPP设计相比，所提出的结构显着减少了片上面积，同时保持了优异的电磁性能。利用这些特性，已经开发了几种使用集成无源器件（IPD）技术的片上实现，包括SSPP传输线、耦合线和基于SSPP的毫米波威尔金森功率分配器，具有宽带、平坦的功率分比。模拟和测量了所提出的SSPP设计的色散曲线和s参数，验证了其片上集成的可行性。

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来源期刊

Microelectronics Journal 工程技术-工程：电子与电气

CiteScore

4.00

自引率

27.30%

发文量

222

审稿时长

43 days

期刊介绍： Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.