Investigation of microstructural evolution and bonding mechanism in sintering of nano-Ag paste on (111)-oriented nanotwinned Cu film

IF 6.9 2区材料科学 Q2 CHEMISTRY, PHYSICAL

Applied Surface Science Pub Date : 2025-06-01 DOI:10.1016/j.apsusc.2025.163697

Jianing Li , Lulin Xie , Fuchu Liu , Hongyong Jiang , Zheng Li , King-Ning Tu , Qinglei Sun

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Abstract

In this research, (111) oriented nt-Cu/nt-Cu joints were bonded using nano-Ag paste as the interlayer, with polycrystal Cu (pc-Cu)/pc-Cu joints as a comparison. The bonding performance and mechanisms between nt-Cu and Ag, as well as between pc-Cu and Ag, were examined. The evolution of bonding interfacial morphology and bonding strength of both joints was studied. The nt-Cu/ntCu optimal joints with highest bonding strength of 24.0 ± 2.0 MPa and smallest porosity of 0.45 ± 0.23 % were obtained by sintering at 280 ℃ in argon, which were greater than the pc-Cu/pc-Cu optimal joints with bonding strength of 19.8 ± 1.4 MPa and porosity of 3.91 ± 1.03 %. Electron backscatter diffraction revealed Ag grain enrichment at the Cu-Ag interface with a homogeneous orientation. Transmission electron microscopy showed that the Cu-Ag interface existed in the form of a solid solution region, and the formation of annealing twins Moiré fringes further enhanced the strength of the Cu-Ag interface. These results offer a new approach for improving interconnections in next-generation devices packaging.

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纳米银浆料在（111）取向纳米孪晶Cu膜上烧结的微观结构演变及键合机制研究

本研究以纳米银浆为夹层，与多晶Cu (pc-Cu)/pc-Cu界面进行了（111）取向的nt-Cu/nt-Cu界面的结合。研究了nt-Cu与Ag、pc-Cu与Ag的键合性能和键合机理。研究了两种接头的结合界面形态和结合强度的演变过程。nt-Cu / nt-Cu最优关节黏合强度最高为24.0 ±2.0  0.45 MPa和最小的孔隙度 ±0.23  %被烧结在280获得 ℃在氩,是大于pc-Cu / pc-Cu最优关节黏合强度为19.8 ±1.4  3.91 MPa和孔隙度 ±1.03  %。电子背散射衍射显示Cu-Ag界面上银晶粒富集，取向均匀。透射电镜显示Cu-Ag界面以固溶区的形式存在，退火孪晶moir条纹的形成进一步增强了Cu-Ag界面的强度。这些结果为改善下一代器件封装中的互连提供了一种新的方法。

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来源期刊

Applied Surface Science 工程技术-材料科学：膜

CiteScore

12.50

自引率

7.50%

发文量

3393

审稿时长

67 days

期刊介绍： Applied Surface Science covers topics contributing to a better understanding of surfaces, interfaces, nanostructures and their applications. The journal is concerned with scientific research on the atomic and molecular level of material properties determined with specific surface analytical techniques and/or computational methods, as well as the processing of such structures.