Multi-physical field simulation and experimental research on inner-jet through-mask electrochemical machining of micro-pit arrays

IF 1.3 4区 化学 Q4 ELECTROCHEMISTRY
Feng Wang, Xinke Yuan, Cheng Zhou, Yiqing Wan, Tao Wang, Xiaokai Wu
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引用次数: 0

Abstract

Micro-textures such as micro-pits and micro-grooves play a significant role in regulating the surface properties of metal components. Through-mask electrochemical machining (TMECM) is a non-contact machining method based on the principle of anodic dissolution. It utilizes an insulating mask to generate micro-texture features in batches on the surface of workpieces, playing a significant role in surface micro-structure processing. This work presents an inner-jet TMECM method to address the challenges of limited machining depth and a narrow machining dimension range in a micro-pit array TMECM. A gas-liquid two-phase flow field model and an electric field model were established. Based on the coupled simulation, the influence of different inner-jet cathodes on the changes in physical quantities was investigated. The simulation results showed that due to the small coverage area of the contracted cathode bottom, the flow velocity in the frontal gap was as high as 9.16 m/s. This led to a reduction in the area of bubble aggregation and a decrease in the low-conductivity region. Therefore, employing a contracted cathode was beneficial for obtaining higher precision micro-pit arrays. In contrast, when using right-angled and extended cathodes, the larger coverage area of the cathode bottom reduced the flow velocity in the frontal gap to below 3 m/s. This led to an increase in bubble formation and aggregation area, resulting in greater fluctuations in conductivity. Moreover, the high current density region with a current density higher than 50 A/cm2 significantly expanded. Therefore, using right-angled and extended cathodes was beneficial for improving the machining efficiency of micro-pit arrays, but the machining accuracy was relatively low. Based on the simulation analysis, comparative experiments were conducted to investigate the coupling effects between inner-jet cathode characteristics and processing parameters on the machining of micro-pit arrays. The resulting variation patterns for micro-pit diameter, depth, and average corrosion coefficient were obtained. Additionally, by utilizing appropriate inner-jet cathodes and machining parameters, the diameter of the micro-pit array can be regulated between 200μm and 470μm, and the depth can be controlled between 0μm and 150μm. This demonstrates that TMECM with an inner-jet cathode can enhance both the dimension range and the depth of micro-pit array machining by regulating the high current density coverage area and electrolyte fluid kinetic energy.
微坑阵列内喷流透掩膜电化学加工的多物理场仿真与实验研究
微坑、微槽等微织构对金属构件的表面性能起着重要的调节作用。透掩膜电化学加工(TMECM)是一种基于阳极溶解原理的非接触加工方法。它利用绝缘掩模在工件表面批量生成微纹理特征,在表面微结构加工中起着重要作用。本文提出了一种内射流TMECM方法,以解决微坑阵列TMECM加工深度有限和加工尺寸范围狭窄的挑战。建立了气液两相流场模型和电场模型。在耦合模拟的基础上,研究了不同的内喷射阴极对其物理量变化的影响。仿真结果表明,由于收缩阴极底部覆盖面积小,前缘间隙内的流速高达9.16 m/s。这导致了气泡聚集面积的减小和低导电性区域的减小。因此,采用收缩阴极有利于获得更高精度的微坑阵列。而采用直角型和延伸型阴极时,由于阴极底部覆盖面积较大,使得前缘间隙内的流速降低到3 m/s以下。这导致气泡形成和聚集面积增加,导致电导率波动更大。电流密度大于50 a /cm2的高电流密度区明显扩大。因此,采用直角和延伸阴极有利于提高微坑阵列的加工效率,但加工精度相对较低。在仿真分析的基础上,通过对比实验研究了内喷流阴极特性与工艺参数对微坑阵列加工的耦合影响。得到了微坑直径、深度和平均腐蚀系数的变化规律。利用合适的内喷射阴极和加工参数,微坑阵列的直径可控制在200μm ~ 470μm之间,深度可控制在0μm ~ 150μm之间。结果表明,内喷流阴极TMECM可以通过调节高电流密度覆盖面积和电解液动能来扩大微坑阵列加工的尺寸范围和深度。
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来源期刊
CiteScore
3.00
自引率
20.00%
发文量
714
审稿时长
2.6 months
期刊介绍: International Journal of Electrochemical Science is a peer-reviewed, open access journal that publishes original research articles, short communications as well as review articles in all areas of electrochemistry: Scope - Theoretical and Computational Electrochemistry - Processes on Electrodes - Electroanalytical Chemistry and Sensor Science - Corrosion - Electrochemical Energy Conversion and Storage - Electrochemical Engineering - Coatings - Electrochemical Synthesis - Bioelectrochemistry - Molecular Electrochemistry
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