{"title":"Investigation of viscous damping in perforated MEMS devices.","authors":"Zeyu Jia, Yuhao Wang, Xiaoxu Wang, Xiang Xu, Jinshuai Sun, Mengqi Sun, Jian Bai, Wei Huang, Qianbo Lu","doi":"10.1038/s41378-025-00928-0","DOIUrl":null,"url":null,"abstract":"<p><p>Perforated structures are widely employed in MEMS devices for dissipation control, energy absorption, and performance optimization. Among these, the damping weakening effect is particularly intriguing, attracting considerable attention and widespread application. Evaluating the impact of perforations on damping is crucial for enhancing the performance of MEMS devices. This paper investigates the damping tuning mechanisms of perforations and presents two theoretical models for accurately predicting viscous damping. The two models exhibit unique advantages under high and low perforation ratios, respectively. Both models account for complex boundary conditions and various hole geometries, including cylindrical, conical, prismatic, and trapezoidal holes. Modeling and simulations demonstrate the complementarity of the two models, enabling accurate viscous damping predictions across nearly all perforation ratios. Subsequently, the theoretical models are validated through a series of vibration tests on perforated oscillators, with errors consistently controlled within 10%. Experimental results demonstrate that perforations can easily achieve a damping reduction of more than one order of magnitude. Moreover, compared to normal cylindrical holes, trapezoidal holes are found to achieve superior damping reduction with a smaller sacrifice in surface area, which holds great potential for capacitive, acoustic, and optical MEMS devices. This work lays the foundation for viscous damping design and optimization of MEMS device dynamics, creating new applications.</p>","PeriodicalId":18560,"journal":{"name":"Microsystems & Nanoengineering","volume":"11 1","pages":"106"},"PeriodicalIF":7.3000,"publicationDate":"2025-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC12106816/pdf/","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microsystems & Nanoengineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1038/s41378-025-00928-0","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"INSTRUMENTS & INSTRUMENTATION","Score":null,"Total":0}
引用次数: 0
Abstract
Perforated structures are widely employed in MEMS devices for dissipation control, energy absorption, and performance optimization. Among these, the damping weakening effect is particularly intriguing, attracting considerable attention and widespread application. Evaluating the impact of perforations on damping is crucial for enhancing the performance of MEMS devices. This paper investigates the damping tuning mechanisms of perforations and presents two theoretical models for accurately predicting viscous damping. The two models exhibit unique advantages under high and low perforation ratios, respectively. Both models account for complex boundary conditions and various hole geometries, including cylindrical, conical, prismatic, and trapezoidal holes. Modeling and simulations demonstrate the complementarity of the two models, enabling accurate viscous damping predictions across nearly all perforation ratios. Subsequently, the theoretical models are validated through a series of vibration tests on perforated oscillators, with errors consistently controlled within 10%. Experimental results demonstrate that perforations can easily achieve a damping reduction of more than one order of magnitude. Moreover, compared to normal cylindrical holes, trapezoidal holes are found to achieve superior damping reduction with a smaller sacrifice in surface area, which holds great potential for capacitive, acoustic, and optical MEMS devices. This work lays the foundation for viscous damping design and optimization of MEMS device dynamics, creating new applications.
期刊介绍:
Microsystems & Nanoengineering is a comprehensive online journal that focuses on the field of Micro and Nano Electro Mechanical Systems (MEMS and NEMS). It provides a platform for researchers to share their original research findings and review articles in this area. The journal covers a wide range of topics, from fundamental research to practical applications. Published by Springer Nature, in collaboration with the Aerospace Information Research Institute, Chinese Academy of Sciences, and with the support of the State Key Laboratory of Transducer Technology, it is an esteemed publication in the field. As an open access journal, it offers free access to its content, allowing readers from around the world to benefit from the latest developments in MEMS and NEMS.