Hao Li, Qiang Liu, Yiming Du, Yanyan Liu, Wei Zhang, Xingyou Tian, Hua Wang
{"title":"Preparation and properties of stretchable low temperature resistant flexible epoxy resin curing agent","authors":"Hao Li, Qiang Liu, Yiming Du, Yanyan Liu, Wei Zhang, Xingyou Tian, Hua Wang","doi":"10.1039/d5py00254k","DOIUrl":null,"url":null,"abstract":"Two innovative molecular design strategies for epoxy curing agents to address the inherent brittleness and cryogenic limitations of conventional epoxy systems are introduced. A silane-modified curing agent (DETA-Si) and a flexible-chain-engineered curing agent (NBO<small><sub><em>n</em></sub></small>) were synthesized to achieve unprecedented mechanical–electrical–thermal synergies. The DETA-Si/EP composite demonstrates a record-breaking elongation at break of 125% (22× improvement over unmodified systems) while maintaining ultralow dielectric loss (tan <em>δ</em> < 0.04) and thermal stability (<em>T</em><small><sub>d</sub></small> = 236 °C). The NBO<small><sub><em>n</em></sub></small> series, incorporating rigid benzene rings and tunable aliphatic chains, exhibits exceptional cryogenic resilience: 18% elongation at 298 K with >50% ductility retention after 24-hour immersion in liquid nitrogen (77 K). Conductive composites cured with EP/NBO<small><sub>10</sub></small> show stable resistance (±5%) under 30-day cryogenic exposure. Free volume engineering, validated <em>via</em> WLF modeling, underpins the enhanced low-temperature performance. These advancements establish a paradigm for epoxy resins in flexible electronics operating under extreme conditions, such as flexible sensors and polar climate devices.","PeriodicalId":100,"journal":{"name":"Polymer Chemistry","volume":"149 1","pages":""},"PeriodicalIF":4.1000,"publicationDate":"2025-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer Chemistry","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.1039/d5py00254k","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0
Abstract
Two innovative molecular design strategies for epoxy curing agents to address the inherent brittleness and cryogenic limitations of conventional epoxy systems are introduced. A silane-modified curing agent (DETA-Si) and a flexible-chain-engineered curing agent (NBOn) were synthesized to achieve unprecedented mechanical–electrical–thermal synergies. The DETA-Si/EP composite demonstrates a record-breaking elongation at break of 125% (22× improvement over unmodified systems) while maintaining ultralow dielectric loss (tan δ < 0.04) and thermal stability (Td = 236 °C). The NBOn series, incorporating rigid benzene rings and tunable aliphatic chains, exhibits exceptional cryogenic resilience: 18% elongation at 298 K with >50% ductility retention after 24-hour immersion in liquid nitrogen (77 K). Conductive composites cured with EP/NBO10 show stable resistance (±5%) under 30-day cryogenic exposure. Free volume engineering, validated via WLF modeling, underpins the enhanced low-temperature performance. These advancements establish a paradigm for epoxy resins in flexible electronics operating under extreme conditions, such as flexible sensors and polar climate devices.
期刊介绍:
Polymer Chemistry welcomes submissions in all areas of polymer science that have a strong focus on macromolecular chemistry. Manuscripts may cover a broad range of fields, yet no direct application focus is required.