Effect of sub-zero temperature on the reliability of SAC305/Cu nanocomposite solder joints

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2025-05-27 DOI:10.1007/s10854-025-14984-9

Yu. Plevachuk, V. Poverzhuk, P. Švec Sr, P. Švec, L. Orovcik, O. Bajana

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引用次数: 0

Abstract

The increasingly widespread use of lead-free solders in electronic devices implies the reliability of solder joints in a wide range of operating temperatures, which also extends to sub-zero temperatures. Based on previous positive results in the solder joints strengthening at elevated temperatures after addition of ceramic nanoparticles to the solder metal matrix, a study of the effect of nickel-coated nanosized SiO₂ admixtures in lead-free Sn–3.5Ag–0.5Cu solders was carried out after longtime exposure to sub-zero temperatures. Coating of SiO₂ nanoparticles with Ni was carried out by the surface modification method, which solved the problem of manufacturing composite solders associated with non-mixing of non-reactive oxides and metal matrix. The research focused on the microstructure and shear strength of the solder joints formed between the nanocomposite solder and two copper substrates, both at room temperature and after 4-month keeping at –20 °C. The results of experimental studies indicate that the addition of Ni-decorated nanosized ceramic impurities to the main solder matrix leads to a decrease in the growth rate of intermetallic layers in soldered joints. The data of tests carried out on samples after exposure to sub-zero temperatures showed no significant decrease in shear strength, demonstrating their effectiveness for soldering components in electronic devices that can operate in a wide range from sub-zero to elevated temperatures.

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低温对SAC305/Cu纳米复合焊点可靠性的影响

无铅焊料在电子设备中的日益广泛使用意味着焊点在广泛的工作温度范围内的可靠性，也延伸到零度以下的温度。基于之前在钎料基体中添加纳米陶瓷颗粒后，在高温下焊点强化的积极结果，研究了镍包覆纳米SiO2外加剂在长期暴露于零度以下的无铅Sn-3.5Ag-0.5Cu钎料中的效果。采用表面改性的方法在SiO2纳米颗粒表面涂覆Ni，解决了非活性氧化物与金属基体不混合制备复合钎料的问题。研究了纳米复合钎料与两种铜衬底之间的焊点在室温和在-20℃下保持4个月后的微观结构和剪切强度。实验结果表明，在主钎料基体中加入ni修饰的纳米陶瓷杂质，可降低焊点金属间层的生长速度。对暴露在零度以下温度下的样品进行的测试数据显示，剪切强度没有显着下降，证明了它们在从零度以下到高温的广泛范围内工作的电子设备中焊接组件的有效性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.