Simultaneous improvement of permittivity and nonlinear properties and loss tangent reduction through semi-wet route in NiO-modified CaCu3Ti4O12 ceramics: grain boundaries effect
IF 2.8 4区 工程技术Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
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引用次数: 0
Abstract
In this study, NiO-modified CaCu3Ti4O12 (CCTO–xNiO) ceramics were successfully synthesized via a semi-wet route, achieving simultaneous enhancement of dielectric and nonlinear properties while reducing dielectric losses. Unlike conventional solid-state methods, this approach offers improved control over grain morphology, leading to a significant reduction in energy dissipation. The impact of NiO doping (x = 0.01, 0.06, 0.15, 0.2) on the microstructure and dielectric characteristics of CCTO ceramics was systematically investigated. SEM analysis revealed a grain size increase from 2.53 µm (x = 0) to 11.46 µm (x = 0.06), followed by a decrease to 1.83 µm (x = 0.15) and 1.03 µm (x = 0.2), demonstrating the effect of NiO on grain growth inhibition. A minor quantity of NiO (x = 0.06) promoted grain growth, leading to enhanced dielectric and electrical properties. The 6% NiO sample exhibited the highest permittivity of 1.2 × 105 at 1 kHz, while the 15% NiO sample displayed the lowest dielectric loss (~ 0.02 at 1 kHz), a higher breakdown voltage (~ 4640 V·cm⁻1), and an enhanced nonlinear coefficient (~ 5.55), confirming its improved insulating performance. These enhancements are attributed to a synergistic effect between NiO doping and grain boundary modifications, as explained by the Schottky barrier and internal barrier layer capacitor (IBLC) models. This study provides new insights into microstructure-property relationships in CCTO ceramics, paving the way for the development of advanced dielectric materials with optimized performance for energy storage and capacitor applications.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.