{"title":"Quaternary PMMA-PEG/SnO₂-SiC Nanocomposite Films for Flexible Nanodielectric and Energy Storage Applications","authors":"Zina Sattar, Ahmed Hashim","doi":"10.1007/s12633-025-03300-z","DOIUrl":null,"url":null,"abstract":"<div><p>The current work aims to enhance the microstructure and dielectric characteristics of SnO<sub>2</sub>-SiC NPs doped blended PMMA-PEG to apply in various flexible nanoelectronics and energy storage applications. The microstructure and dielectric characteristics of PMMA-PEG/SnO<sub>2</sub>-SiC films were studied. The investigation of microstructure properties for PMMA-PEG/SnO<sub>2</sub>-SiC films revealed a significant presence of SnO<sub>2</sub>-SiC NPs inside PMMA/PEG as well as good integration between SnO<sub>2</sub>-SiC NPs and PMMA-PEG matrix. The dielectric properties results indicated to the increment in dielectric parameters of blended PMMA-PEG as the content of SnO<sub>2</sub>-SiC NPs rise. The increment ratios of dielectric constant and conductivity of PMMA-PEG are 73% and 38%, respectively, with low values of dielectric loss ranging from 0.38 to 0.74 at 100 Hz. These findings indicated that PMMA-PEG/SnO<sub>2</sub>-SiC films could be useful in many nanoelectronics applications. The dielectric properties of PMMA-PEG/SnO<sub>2</sub>-SiC films altered as the frequency is rise. Because of their few cost, great capacity of energy storage, and low loss of energy, the PMMA-PEG/SnO<sub>2</sub>-SiC films have good dielectric properties to be employed in a wide range of flexible nanoelectronics applications. The pressure sensor results showed the PMMA/PEG/SnO<sub>2</sub>/SiC films included high sensitivity at pressure sensor ranging of 80 bar to 160 bar. By comparison of PMMA-PEG/SnO<sub>2</sub>-SiC films with other sensors, the fabricated films demonstrated great pressure sensitivity, excellent flexibility, and strong environmental durability.</p></div>","PeriodicalId":776,"journal":{"name":"Silicon","volume":"17 7","pages":"1681 - 1692"},"PeriodicalIF":2.8000,"publicationDate":"2025-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Silicon","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s12633-025-03300-z","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
The current work aims to enhance the microstructure and dielectric characteristics of SnO2-SiC NPs doped blended PMMA-PEG to apply in various flexible nanoelectronics and energy storage applications. The microstructure and dielectric characteristics of PMMA-PEG/SnO2-SiC films were studied. The investigation of microstructure properties for PMMA-PEG/SnO2-SiC films revealed a significant presence of SnO2-SiC NPs inside PMMA/PEG as well as good integration between SnO2-SiC NPs and PMMA-PEG matrix. The dielectric properties results indicated to the increment in dielectric parameters of blended PMMA-PEG as the content of SnO2-SiC NPs rise. The increment ratios of dielectric constant and conductivity of PMMA-PEG are 73% and 38%, respectively, with low values of dielectric loss ranging from 0.38 to 0.74 at 100 Hz. These findings indicated that PMMA-PEG/SnO2-SiC films could be useful in many nanoelectronics applications. The dielectric properties of PMMA-PEG/SnO2-SiC films altered as the frequency is rise. Because of their few cost, great capacity of energy storage, and low loss of energy, the PMMA-PEG/SnO2-SiC films have good dielectric properties to be employed in a wide range of flexible nanoelectronics applications. The pressure sensor results showed the PMMA/PEG/SnO2/SiC films included high sensitivity at pressure sensor ranging of 80 bar to 160 bar. By comparison of PMMA-PEG/SnO2-SiC films with other sensors, the fabricated films demonstrated great pressure sensitivity, excellent flexibility, and strong environmental durability.
期刊介绍:
The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.