Interface and dielectric properties of Al/p-Si diode by organic composite interlayer for MOS

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
S. Demirezen, A. Dere, H. G. Çetinkaya, Shehab A. Mansour, F. Yakuphanoglu
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引用次数: 0

Abstract

Thin films with different ratios (0, 0.5, and 2 wt%) of GO-doped P3HT:PCBM were synthesized on p-Si wafers using the spin coating technique to create Al/GO:P3HT:PCBM/p-Si structures. In order to comprehensively investigate the effect of GO doping on P3HT:PCBM in terms of AC electrical conductivity (σac), complex permittivity (ε*), complex electric modulus (M*), and complex impedance (Z*), we have performed capacitance/conductance-voltage (C/G-V) measurements on Al/GO:P3HT:PCBM/p-Si structures over a wide range of frequencies and voltages. Different ratios (0, 0.5, and 2 wt%) of GO in P3HT:PCBM layers were deposited on a p-type Si wafer as an interlayer. The values of the complex dielectric constant/loss (εʹ/ε″), the loss tangent (tanδ), the AC electrical conductivity (σac), and the real/imaginary components of the complex electric modulus (Mʹ, M″) were determined from the C/G-V measurements as a function of frequency, ranging from 0.5 to 2.5 V with 100 mV steps. All parameters showed distinct frequency/voltage dependencies, surface/dipole polarizations, and interlayer effects, especially at low and intermediate frequencies. In particular, the elevated dielectric constants measured (approximately 52 for 0.5% GO concentration and 60 for 2% GO concentration) at frequencies as high as 10 kHz indicate that GO:P3HT thin films are a viable alternative to conventional SiO2 dielectrics. The real component of the dielectric permittivity maintained at 10 kHz exceeds that of conventional SiO2 insulators (3.8) by a factor of 16, demonstrating the superior charge storage capacity of these composite films and their potential to replace standard insulators in energy storage applications. Furthermore, the value of σac increased with increasing doping rate of GO, indicating potential advantages of using high-dielectric organic thin films between metal and semiconductor instead of conventional metal/oxide/semiconductor (MOS) structures. The plot of ln(σₐₐ) as a function of ln(f) for the synthesized structures reveals two distinct linear regions, each characterized by varying slopes. This finding indicates the presence of two independent conduction mechanisms operating within the structures at ambient temperature. Moreover, the M″ exhibits a significant peak, the location of which advances toward higher frequencies as the applied voltage increases. This peak phenomenon can be ascribed to a diminution in polarization effects alongside contributions arising from interfacial or surface states.

MOS有机复合中间层制备Al/p-Si二极管的界面和介电性能
采用自旋镀膜技术在p-Si晶片上合成了不同比例(0、0.5和2 wt%)的GO掺杂P3HT:PCBM薄膜,形成Al/GO:P3HT:PCBM/p-Si结构。为了全面研究氧化石墨烯掺杂对P3HT:PCBM在交流电导率(σac)、复介电常数(ε*)、复电模量(M*)和复阻抗(Z*)方面的影响,我们在广泛的频率和电压范围内对Al/GO:P3HT:PCBM/p-Si结构进行了电容/电导-电压(C/G-V)测量。P3HT:PCBM层中不同比例(0、0.5和2 wt%)的GO沉积在p型硅片上作为中间层。复介电常数/损耗(ε′/ε″)、损耗正切(tanδ)、交流电导率(σac)和复电模量的实/虚分量(M′,M″)随频率的变化规律由C/G-V测量得到,频率范围为0.5 ~ 2.5 V,步长为100 mV。所有参数都表现出明显的频率/电压依赖性、表面/偶极极化和层间效应,尤其是在低频和中频下。特别是,在高达10 kHz的频率下,测量到的介电常数升高(0.5%氧化石墨烯浓度约为52,2%氧化石墨烯浓度约为60)表明,GO:P3HT薄膜是传统SiO2介电材料的可行替代品。维持在10 kHz的介电常数的实际分量超过了传统SiO2绝缘体(3.8)的16倍,表明这些复合薄膜具有优越的电荷存储能力,并有可能取代储能应用中的标准绝缘体。此外,σac随氧化石墨烯掺杂率的增加而增加,表明在金属和半导体之间使用高介电有机薄膜取代传统的金属/氧化物/半导体(MOS)结构具有潜在的优势。合成结构的ln(σ)作为ln(f)的函数图显示了两个不同的线性区域,每个区域都有不同的斜率。这一发现表明在环境温度下存在两种独立的传导机制。此外,M″表现出一个显著的峰值,其位置随着施加电压的增加而向更高的频率前进。这种峰值现象可以归因于极化效应的减少以及界面或表面状态产生的贡献。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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