Effect of mechanochemical milling on the properties of Ag₂O self-reducing pastes for conductive layers in flexible electronics

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Alena Pietrikova, Peter Provazek, Peter Lukacs, Daniel Dzivy, Karel Saksl, Beata Ballokova, Robert Dzunda, Peter Nemergut
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引用次数: 0

Abstract

This work investigates the production of conductive silver layers at low temperatures by the mechanochemical processing of silver oxide (Ag2O) particles. Using modified Ag2O particles in a planetary ball mill, a cost-effective method for producing a self-reducing polymer paste is developed. Milling for 5, 10, or 15 h results in smaller particles and increased surface activity, which enables effective Ag2O reduction at low temperatures. A paste containing 70% AgO particles milled for 5 h exhibits long-term stability and forms conductive silver layers in 25 min at 130 °C. Heat and reducing agents reduce Ag2O to Ag, achieving a sheet resistance of 21.794 mΩ/□ with 2 printed layers. After two months, stability tests validate the paste’s rheological stability. These results demonstrate the possibility of creating flexible silver layers using a low-cost Ag2O-based paste, offering a sustainable and efficient approach for low-cost electronics. The most appropriate milling time is 5 h, producing particles suitable for printing (0.252–6.325 µm).

机械化学铣削对柔性电子导电层用Ag₂O自还原浆料性能的影响
本文研究了在低温下通过机械化学处理氧化银(Ag2O)颗粒制备导电银层的方法。在行星球磨机中利用改性Ag2O颗粒,开发了一种具有成本效益的自还原聚合物糊料生产方法。研磨5、10或15小时,颗粒变小,表面活性增加,在低温下可以有效还原Ag2O。含有70% AgO颗粒的浆料在130°C下研磨5小时后表现出长期稳定性,并在25分钟内形成导电银层。热和还原剂将Ag2O还原为Ag,达到2层印刷的21.794 mΩ/□的片电阻。两个月后,稳定性测试验证了膏体的流变稳定性。这些结果证明了使用低成本ag20基浆料制造柔性银层的可能性,为低成本电子产品提供了一种可持续和高效的方法。最合适的磨矿时间为5 h,可制得适合打印的颗粒(0.252-6.325µm)。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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