Alena Pietrikova, Peter Provazek, Peter Lukacs, Daniel Dzivy, Karel Saksl, Beata Ballokova, Robert Dzunda, Peter Nemergut
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引用次数: 0
Abstract
This work investigates the production of conductive silver layers at low temperatures by the mechanochemical processing of silver oxide (Ag2O) particles. Using modified Ag2O particles in a planetary ball mill, a cost-effective method for producing a self-reducing polymer paste is developed. Milling for 5, 10, or 15 h results in smaller particles and increased surface activity, which enables effective Ag2O reduction at low temperatures. A paste containing 70% AgO particles milled for 5 h exhibits long-term stability and forms conductive silver layers in 25 min at 130 °C. Heat and reducing agents reduce Ag2O to Ag, achieving a sheet resistance of 21.794 mΩ/□ with 2 printed layers. After two months, stability tests validate the paste’s rheological stability. These results demonstrate the possibility of creating flexible silver layers using a low-cost Ag2O-based paste, offering a sustainable and efficient approach for low-cost electronics. The most appropriate milling time is 5 h, producing particles suitable for printing (0.252–6.325 µm).
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.