ResiLogic: Leveraging Composability and Diversity to Design Fault and Intrusion Resilient Chips

IF 2.8 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Ahmad T. Sheikh;Ali Shoker;Suhaib A. Fahmy;Paulo Esteves-Verissimo
{"title":"ResiLogic: Leveraging Composability and Diversity to Design Fault and Intrusion Resilient Chips","authors":"Ahmad T. Sheikh;Ali Shoker;Suhaib A. Fahmy;Paulo Esteves-Verissimo","doi":"10.1109/TVLSI.2025.3544860","DOIUrl":null,"url":null,"abstract":"A long-standing challenge is the design of chips resilient to faults and glitches. Both fine-grained gate diversity and coarse-grained modular redundancy have been used in the past. However, these approaches have not been well-studied under other threat models where some stakeholders in the supply chain are untrusted. Increasing digital sovereignty tensions raise concerns regarding the use of foreign off-the-shelf tools and intellectual property (IP), or off-sourcing fabrication, driving research into the design of resilient chips under this threat model. This article addresses a threat model considering three pertinent attacks to resilience: distribution, zonal, and compound attacks. To mitigate these attacks, we introduce the <italic>ResiLogic</i> framework that exploits <italic>Diversity by Composability</i>: constructing diverse circuits composed of smaller diverse ones by design. This approach enables designers to develop circuits in the early stages of design without the need for additional redundancy in terms of space or cost. To generate diverse circuits, we propose a technique using E-Graphs with new rewrite definitions for diversity. Using this approach at different levels of granularity is shown to improve the resilience of circuit design in <italic>ResiLogic</i> up to <inline-formula> <tex-math>$\\times 5$ </tex-math></inline-formula> against the three considered attacks.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 6","pages":"1751-1764"},"PeriodicalIF":2.8000,"publicationDate":"2025-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10934979/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0

Abstract

A long-standing challenge is the design of chips resilient to faults and glitches. Both fine-grained gate diversity and coarse-grained modular redundancy have been used in the past. However, these approaches have not been well-studied under other threat models where some stakeholders in the supply chain are untrusted. Increasing digital sovereignty tensions raise concerns regarding the use of foreign off-the-shelf tools and intellectual property (IP), or off-sourcing fabrication, driving research into the design of resilient chips under this threat model. This article addresses a threat model considering three pertinent attacks to resilience: distribution, zonal, and compound attacks. To mitigate these attacks, we introduce the ResiLogic framework that exploits Diversity by Composability: constructing diverse circuits composed of smaller diverse ones by design. This approach enables designers to develop circuits in the early stages of design without the need for additional redundancy in terms of space or cost. To generate diverse circuits, we propose a technique using E-Graphs with new rewrite definitions for diversity. Using this approach at different levels of granularity is shown to improve the resilience of circuit design in ResiLogic up to $\times 5$ against the three considered attacks.
弹性逻辑:利用可组合性和多样性来设计故障和入侵弹性芯片
一个长期存在的挑战是芯片对故障和小故障的弹性设计。细粒度门分集和粗粒度模块化冗余在过去都被使用过。然而,这些方法还没有在其他威胁模型下得到很好的研究,其中供应链中的一些利益相关者是不可信的。日益加剧的数字主权紧张局势引发了人们对使用外国现成工具和知识产权(IP)或外包制造的担忧,推动了这种威胁模型下弹性芯片设计的研究。本文讨论了一个威胁模型,该模型考虑了与弹性相关的三种攻击:分布攻击、区域攻击和复合攻击。为了减轻这些攻击,我们引入了通过可组合性利用多样性的ResiLogic框架:通过设计构建由较小的多样化电路组成的多样化电路。这种方法使设计人员能够在设计的早期阶段开发电路,而无需在空间或成本方面增加额外的冗余。为了生成不同的电路,我们提出了一种使用e - graph的技术,该技术具有新的重写的多样性定义。在不同的粒度级别上使用这种方法可以提高resillogic中电路设计的弹性,最高可达$\times 5$,以抵御三种考虑的攻击。
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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