{"title":"A Robust Computing-in-Memory Macro With 2T1R1C Cells and Reused Capacitors for Successive-Approximation ADC","authors":"Rui Xiao;Minghan Jiang;Xinran Li;Haibin Shen;Kejie Huang","doi":"10.1109/TVLSI.2025.3539826","DOIUrl":null,"url":null,"abstract":"Computing-in-memory (CIM) has emerged as a practical paradigm to bypass the von Neumann bottleneck. However, traditional CIM schemes face challenges due to the nonideal characteristics of nonvolatile memory (NVM). To address this issue, this work provides a resistive random access memory (RRAM)-based CIM macro employing two-transistor-one-RRAM–one-capacitor (2T1R1C) cells, with capacitors reused for the successive-approximation analog-to-digital converter (SAR ADC). Single-level RRAM is utilized to mitigate resistance variation. The multiply-accumulate (MAC) operation is performed via the charge and discharge of capacitors, enhancing robustness across different process, voltage, and temperature (PVT) corners. The capacitors in 2T1R1C cells are repurposed as sampling capacitors to integrate the ADC with the array. A precision-adjustable SAR (PA-SAR) logic is proposed to generate partial sums at varying precision levels aligned with different input bits, optimizing energy efficiency while maintaining reliability. Our proposed 2T1R1C array features an average area of <inline-formula> <tex-math>$3.403~\\mu $ </tex-math></inline-formula>m2 for each cell, which accounts for 87.46% of the total macro area. The total macro area is 1.020 mm2 with a capacity of 256 Kb, achieving an energy density of 0.201 TOPS/mm2. The PA-SAR logic boosts energy efficiency to 44.71 TOPS/W, marking a 38.55% improvement over conventional full-precision schemes.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 6","pages":"1693-1704"},"PeriodicalIF":2.8000,"publicationDate":"2025-02-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10905048/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
Computing-in-memory (CIM) has emerged as a practical paradigm to bypass the von Neumann bottleneck. However, traditional CIM schemes face challenges due to the nonideal characteristics of nonvolatile memory (NVM). To address this issue, this work provides a resistive random access memory (RRAM)-based CIM macro employing two-transistor-one-RRAM–one-capacitor (2T1R1C) cells, with capacitors reused for the successive-approximation analog-to-digital converter (SAR ADC). Single-level RRAM is utilized to mitigate resistance variation. The multiply-accumulate (MAC) operation is performed via the charge and discharge of capacitors, enhancing robustness across different process, voltage, and temperature (PVT) corners. The capacitors in 2T1R1C cells are repurposed as sampling capacitors to integrate the ADC with the array. A precision-adjustable SAR (PA-SAR) logic is proposed to generate partial sums at varying precision levels aligned with different input bits, optimizing energy efficiency while maintaining reliability. Our proposed 2T1R1C array features an average area of $3.403~\mu $ m2 for each cell, which accounts for 87.46% of the total macro area. The total macro area is 1.020 mm2 with a capacity of 256 Kb, achieving an energy density of 0.201 TOPS/mm2. The PA-SAR logic boosts energy efficiency to 44.71 TOPS/W, marking a 38.55% improvement over conventional full-precision schemes.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.