Numerical and experimental investigation of heat transfer in a dimpled and petaled array tube with a coiled twisted tape and SiC nanofluid

IF 6.4 2区工程技术 Q1 THERMODYNAMICS

Case Studies in Thermal Engineering Pub Date : 2025-05-16 DOI:10.1016/j.csite.2025.106349

Hariam Luqman Azeez , Adnan Ibrahim , Banw Omer Ahmed , Sharul Sham Dol , Ali H.A. Al-Waeli , Mahmoud Jaber

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引用次数: 0

Abstract

Thermal efficiency challenges are common in absorber tube designs. This study proposes an innovative absorber tube featuring dimples and petal arrays on its surface, integrated with a coiled twisted tape, and circulating a 0.9 % volume concentration of silicon carbide (SiC)-enhanced nanofluid. Fixing heat flux at 1000 W/m² and Reynold number between 720 and 5030, Computational Fluid Dynamics (CFD) was employed to optimize key dimple parameters, encompassing dimple lines number (ranging from 2 to 6), dimple diameter (1–5 mm), dimple height (0.8–2 mm), and dimple pitch distance (10–30 mm). Additionally, Thermohydraulic Performance Factor (THPF) assessment was conducted experimentally to examine the impact of petal arrays, coil, twisted tape, and three concentrations of SiC-enhanced nanofluid on the optimized dimple tube. The results indicate that a configuration with five dimple lines, a dimple diameter of 3 mm, a dimple height of 1.4 mm, and a dimple pitch distance of 10 mm provides optimal heat transfer augmentation. Furthermore, incorporating 0.9 % SiC with a coiled twisted tape into the optimized dimpled and petaled array tube design enhances the THPF by 71.1 %, demonstrating a substantial improvement in thermohydraulic performance.

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带有缠绕带和SiC纳米流体的凹陷花瓣阵列管传热的数值和实验研究

热效率的挑战是常见的吸收管设计。本研究提出了一种创新的吸收管，其表面具有凹痕和花瓣阵列，与卷曲的扭曲带集成，并循环体积浓度为0.9%的碳化硅（SiC）增强纳米流体。将热流密度设为1000 W/m2，雷诺数为720 ~ 5030，利用计算流体力学（CFD）对窝纹数（2 ~ 6条）、窝径（1 ~ 5 mm）、窝高（0.8 ~ 2 mm）、窝距（10 ~ 30 mm）等关键参数进行优化。此外，通过实验考察了花瓣阵列、线圈、扭曲带和三种sic增强纳米流体浓度对优化后的凹窝管的热液性能因子（THPF）的影响。结果表明，5条凹痕线、凹痕直径为3 mm、凹痕高度为1.4 mm、凹痕间距为10 mm的结构具有最佳的增热效果。此外，将0.9%的碳化硅与缠绕的扭曲带结合到优化的凹陷和花瓣阵列管设计中，THPF提高了71.1%，表明热压性能有了显著改善。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Case Studies in Thermal Engineering Chemical Engineering-Fluid Flow and Transfer Processes

CiteScore

8.60

自引率

11.80%

发文量

812

审稿时长

76 days

期刊介绍： Case Studies in Thermal Engineering provides a forum for the rapid publication of short, structured Case Studies in Thermal Engineering and related Short Communications. It provides an essential compendium of case studies for researchers and practitioners in the field of thermal engineering and others who are interested in aspects of thermal engineering cases that could affect other engineering processes. The journal not only publishes new and novel case studies, but also provides a forum for the publication of high quality descriptions of classic thermal engineering problems. The scope of the journal includes case studies of thermal engineering problems in components, devices and systems using existing experimental and numerical techniques in the areas of mechanical, aerospace, chemical, medical, thermal management for electronics, heat exchangers, regeneration, solar thermal energy, thermal storage, building energy conservation, and power generation. Case studies of thermal problems in other areas will also be considered.