Ling‘en Liu , Yixu Zhang , Ni Wang , Liang Tang , Chaoyang Yan , Jianli Zhou , Wenjie Gao , Yuefei Zhang , Junxia Lv , Ze Zhang
{"title":"Image drift compensation in scanning electron microscopy facilitated by an external scanning and imaging system","authors":"Ling‘en Liu , Yixu Zhang , Ni Wang , Liang Tang , Chaoyang Yan , Jianli Zhou , Wenjie Gao , Yuefei Zhang , Junxia Lv , Ze Zhang","doi":"10.1016/j.micron.2025.103848","DOIUrl":null,"url":null,"abstract":"<div><div>Microstructures significantly influence the physical properties of materials. Characterizing the evolution of materials' microstructures is helpful for exploring the processing techniques and understanding the thermodynamic properties of materials. However, the in-situ experiments based on the scanning electron microscope (SEM) often suffer from non-uniform image drift distortion, which severely interferes with the imaging and characterization. Therefore, in this study, we develop an external scanning and imaging system for dynamic image drift compensation during the in-situ SEM experiments. The drifted image was dynamically corrected to the center of view by changing the path of the electron beams. The proposed method was compared with three conventional image correction methods to validate its effectiveness in two scenarios, i.e., in-situ translation experiment and in-situ heating experiment. The results showed that the image registration technique combined with the electron beam trajectory correction effectively compensated the image drift caused by irregular sample motion. Compared with existing image post-processing methods, we have achieved real-time drift compensation of the images. For the secondary electron (SE) image with a resolution of 1024 × 1024 pixels compensated based on the method proposed in this paper, the maximum pixel loss within the field of view is only 3 pixels. This technology can effectively correct image drift caused by high temperatures during the in-situ progress, thereby helping material characterization.</div></div>","PeriodicalId":18501,"journal":{"name":"Micron","volume":"196 ","pages":"Article 103848"},"PeriodicalIF":2.2000,"publicationDate":"2025-05-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Micron","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0968432825000666","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MICROSCOPY","Score":null,"Total":0}
引用次数: 0
Abstract
Microstructures significantly influence the physical properties of materials. Characterizing the evolution of materials' microstructures is helpful for exploring the processing techniques and understanding the thermodynamic properties of materials. However, the in-situ experiments based on the scanning electron microscope (SEM) often suffer from non-uniform image drift distortion, which severely interferes with the imaging and characterization. Therefore, in this study, we develop an external scanning and imaging system for dynamic image drift compensation during the in-situ SEM experiments. The drifted image was dynamically corrected to the center of view by changing the path of the electron beams. The proposed method was compared with three conventional image correction methods to validate its effectiveness in two scenarios, i.e., in-situ translation experiment and in-situ heating experiment. The results showed that the image registration technique combined with the electron beam trajectory correction effectively compensated the image drift caused by irregular sample motion. Compared with existing image post-processing methods, we have achieved real-time drift compensation of the images. For the secondary electron (SE) image with a resolution of 1024 × 1024 pixels compensated based on the method proposed in this paper, the maximum pixel loss within the field of view is only 3 pixels. This technology can effectively correct image drift caused by high temperatures during the in-situ progress, thereby helping material characterization.
期刊介绍:
Micron is an interdisciplinary forum for all work that involves new applications of microscopy or where advanced microscopy plays a central role. The journal will publish on the design, methods, application, practice or theory of microscopy and microanalysis, including reports on optical, electron-beam, X-ray microtomography, and scanning-probe systems. It also aims at the regular publication of review papers, short communications, as well as thematic issues on contemporary developments in microscopy and microanalysis. The journal embraces original research in which microscopy has contributed significantly to knowledge in biology, life science, nanoscience and nanotechnology, materials science and engineering.