Electromagnetic shielding effectiveness of surface modified porous watermelon rinds biochar nutmeg short fibre reinforced lightweight vinyl ester biocomposite

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
K. Kanchana, K. J. Anoop, V. P. Vinod, K. K. Kavitha, Mathur Nadarajan Kathiravan
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引用次数: 0

Abstract

The present research aims to develop an Electromagnetic interference (EMI) shielding which is light weight by natural fiber, and filler reinforced polymer composite. The novelty of this study producing composite using waste biomass by treating the fiber and filler surface modification. As well as analysing the mechanical, dielectric, and EMI shielding efficiency of the composite in accordance to the ASTM (American Society for Testing and Materials) standard. The study founded that composite VNB2, with 2.0 vol.% biochar and 30 vol.% silane-treated nutmeg shell fiber, demonstrates the best mechanical performance, with a tensile strength of 154 MPa, tensile modulus of 5.6 GPa, flexural strength of 221 MPa, flexural modulus of 6.1 GPa, and it is 175%, 229.4%, 151.1%, 177.3%, respectively. However, the impact strength and hardness properties are improved with increase filler content of 4 vol.% of biochar and 30 vol.% silane-treated nutmeg shell fiber on composite VNB3, that is 5.8 J, and 90 shore-d and it is 383.3%and 9.8% increase when compared plain vinyl ester composite V, respectively, suggests that the combination of fiber and biochar provides excellent toughness. Similarly, the dielectric constant of VNB3 reaches 6.62, 5.57, 4.41, and 3.89 at E, F, I, and J, respectively, which it is 97.02%, 104.02%, 99.54%, 131.54%, respectively, due to the formation of conductive networks and improved interfacial polarization. Additionally, the highest EMI shielding effectiveness is observed in VNB3, reaching 8.82, 14.28, 20.16, and 29.82 dB at E, F, I, and J, respectively and it is 299.09% 61.90%, 52.38% 50.22%, respectively, indicating that the increased biochar content enhances charge transport and multiple reflections, optimizing wave attenuation. Owing to such features it could be applied in most of electric and electronic equipment used industries like space craft, communication, navigation, medical, automobile, and information technology, etc.

表面改性多孔西瓜皮生物炭肉豆蔻短纤维增强轻质乙烯基酯生物复合材料的电磁屏蔽效果
本研究旨在利用天然纤维和填料增强聚合物复合材料开发一种轻型电磁干扰屏蔽材料。本研究的新颖之处在于通过对废生物质进行纤维处理和填料表面改性制备复合材料。并根据ASTM(美国材料测试协会)标准分析复合材料的机械、介电和EMI屏蔽效率。研究发现,添加2.0 vol.%生物炭和30 vol.%硅烷处理肉豆科壳纤维的复合材料VNB2力学性能最佳,抗拉强度为154 MPa,抗拉模量为5.6 GPa,抗弯强度为221 MPa,抗弯模量为6.1 GPa,分别为175%,229.4%,151.1%,177.3%。然而,在复合材料VNB3上添加4 vol.%的生物炭和30 vol.%的硅烷处理肉豆蔻壳纤维,其冲击强度和硬度性能随着填料含量的增加而提高,分别为5.8 J和90 share -d,与普通乙烯基酯复合材料V相比,分别提高了383.3%和9.8%,表明纤维和生物炭的组合具有优异的韧性。同样,VNB3在E、F、I、J处的介电常数分别为6.62、5.57、4.41、3.89,分别为97.02%、104.02%、99.54%、131.54%,这是由于导电网络的形成和界面极化的改善。此外,VNB3在E、F、I和J处的屏蔽效率最高,分别达到8.82、14.28、20.16和29.82 dB,分别为299.09%、61.90%、52.38%和50.22%,说明生物炭含量的增加增强了电荷传输和多次反射,优化了波的衰减。由于这些特点,它可以应用于大多数电气和电子设备使用的行业,如航天器、通信、导航、医疗、汽车和信息技术等。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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