Using MD simulation to evaluate the effects of working fluid, wall material, and wall layering of a nano-grooved flat plate heat pipe

IF 6.4 2区工程技术 Q1 THERMODYNAMICS

Case Studies in Thermal Engineering Pub Date : 2025-05-14 DOI:10.1016/j.csite.2025.106331

Gholamreza Ahmadi, Mohammad Ameri, Ali Jahangiri

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Abstract

Monitoring and dissipating the heat generated by semiconductor-based components, including microprocessors, is necessary for their stability and optimal performance. The use of heat pipes (HPs) as passive instruments makes this possible without the need for any additional energy sources. The application of flat plate nano-HPs in microprocessors has materialized by recent developments in nanoscale device manufacturing. The effectiveness of a cell of this kind of HP has been investigated in this article. While focusing on the impact of wall thickness, the velocity, density, and temperature profiles, and also mass and heat transmission have been calculated under various circumstances. The molecular dynamics simulation findings indicated that the mass transfer rate has increased as the wall layer numbers have increased, under all circumstances. The atomic structure of the working fluid has a significant impact on the mass transfer rate inside nano-HPs. The maximum and minimum heat fluxes are 1896 W/cm² and 1392 W/cm², which respectively relate to water and argon. The overall performance of HP significantly relates to the circulation rate of the working fluid. Using Cu-EtOH leads to the maximum mean velocity (0.096 Å/ps). Cu-EtOH and Pt-Ar respectively, shows the highest and lowest average temperatures, as 463.1 K and 404.7 K.

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采用MD模拟方法评价了工质、管壁材料和管壁分层对纳米开槽平板热管的影响

监控和散热半导体组件（包括微处理器）产生的热量对于其稳定性和最佳性能是必要的。使用热管（hp）作为被动仪器使这成为可能，而不需要任何额外的能源。随着纳米器件制造技术的发展，平板纳米hp在微处理器中的应用已经成为现实。本文对这种HP细胞的有效性进行了研究。在着重考虑壁厚影响的同时，计算了各种情况下的速度、密度、温度分布，以及质量和传热。分子动力学模拟结果表明，在任何情况下，传质速率都随着壁层数的增加而增加。工作流体的原子结构对纳米hp内部的传质速率有显著影响。最大和最小热流密度分别为1896 W/cm2和1392 W/cm2，分别与水和氩有关。HP的整体性能与工作液的循环速率密切相关。使用Cu-EtOH可获得最大平均流速（0.096 Å/ps）。Cu-EtOH和Pt-Ar的平均温度分别为463.1 K和404.7 K。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Case Studies in Thermal Engineering Chemical Engineering-Fluid Flow and Transfer Processes

CiteScore

8.60

自引率

11.80%

发文量

812

审稿时长

76 days

期刊介绍： Case Studies in Thermal Engineering provides a forum for the rapid publication of short, structured Case Studies in Thermal Engineering and related Short Communications. It provides an essential compendium of case studies for researchers and practitioners in the field of thermal engineering and others who are interested in aspects of thermal engineering cases that could affect other engineering processes. The journal not only publishes new and novel case studies, but also provides a forum for the publication of high quality descriptions of classic thermal engineering problems. The scope of the journal includes case studies of thermal engineering problems in components, devices and systems using existing experimental and numerical techniques in the areas of mechanical, aerospace, chemical, medical, thermal management for electronics, heat exchangers, regeneration, solar thermal energy, thermal storage, building energy conservation, and power generation. Case studies of thermal problems in other areas will also be considered.