Peng Wang, Kunlin Wang, Qianwen Li, Lin Tong, Yue Shen, Sirui Chen, Jue Wang, Ping Wang
{"title":"An ultrasound imaging algorithm for enhancing the imaging quality of piezoelectric transducer array ultrasound imaging systems","authors":"Peng Wang, Kunlin Wang, Qianwen Li, Lin Tong, Yue Shen, Sirui Chen, Jue Wang, Ping Wang","doi":"10.1016/j.sna.2025.116702","DOIUrl":null,"url":null,"abstract":"<div><div>Ultrasonic imaging, as a fundamental methodology in nondestructive testing, achieves defect characterization through acoustic interaction mechanisms including reflection at impedance boundaries, microstructural scattering, and frequency-dependent attenuation. However, conventional delay-and-sum (DAS) beamforming compromises spatial resolution and contrast performance due to inherent limitations such as main lobe broadening, sidelobe leakage artifacts, and coherent noise interference. The spatial spectrum coherence factor (SSCF) algorithm proposed in this paper is based on the difference in the energy distribution of the spatial spectrum of the echo data after the Fourier transform, and enhances the differentiation between the defects and the background region by the product of the low-frequency component and the total energy; the coherence energy factor (CEF) algorithm proposed in this paper combines the 2-norm energy characterization of the echo signal with the symbolic coherence weighting to suppress the background clutter and reserve the details of the defects. Then the SSCF methodand CEF method are fused to obtain the SSCF-CEF beamforming algorithm, which achieves a more significant enhancement of the imaging effect. The experiment utilizes 20# carbon steel test block, aluminum test block and actual rail test block to verify the effectiveness of the algorithm. The results show that: compared with DAS, the SSCF-CEF algorithm improves the contrast ratio (CR) by 438.26 % and reduces the array performance index (API) by 47.14 % in 20# steel specimen; the half-peak full-width value is optimized to 1.78 mm in the aluminum specimen experiment, which is 53.9 % lower than that of DAS, and compressed API by 90.21 % compared with DAS and achieved a jump of CR by 172.39 %; the CR in the rail inspection scenario is improved by 287.16 %, while the API is reduced by 91.81 %. In addition, SSCF and CEF alone are significantly better than traditional generalized coherence factor and coherence factor algorithms.</div></div>","PeriodicalId":21689,"journal":{"name":"Sensors and Actuators A-physical","volume":"392 ","pages":"Article 116702"},"PeriodicalIF":4.9000,"publicationDate":"2025-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensors and Actuators A-physical","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0924424725005084","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Ultrasonic imaging, as a fundamental methodology in nondestructive testing, achieves defect characterization through acoustic interaction mechanisms including reflection at impedance boundaries, microstructural scattering, and frequency-dependent attenuation. However, conventional delay-and-sum (DAS) beamforming compromises spatial resolution and contrast performance due to inherent limitations such as main lobe broadening, sidelobe leakage artifacts, and coherent noise interference. The spatial spectrum coherence factor (SSCF) algorithm proposed in this paper is based on the difference in the energy distribution of the spatial spectrum of the echo data after the Fourier transform, and enhances the differentiation between the defects and the background region by the product of the low-frequency component and the total energy; the coherence energy factor (CEF) algorithm proposed in this paper combines the 2-norm energy characterization of the echo signal with the symbolic coherence weighting to suppress the background clutter and reserve the details of the defects. Then the SSCF methodand CEF method are fused to obtain the SSCF-CEF beamforming algorithm, which achieves a more significant enhancement of the imaging effect. The experiment utilizes 20# carbon steel test block, aluminum test block and actual rail test block to verify the effectiveness of the algorithm. The results show that: compared with DAS, the SSCF-CEF algorithm improves the contrast ratio (CR) by 438.26 % and reduces the array performance index (API) by 47.14 % in 20# steel specimen; the half-peak full-width value is optimized to 1.78 mm in the aluminum specimen experiment, which is 53.9 % lower than that of DAS, and compressed API by 90.21 % compared with DAS and achieved a jump of CR by 172.39 %; the CR in the rail inspection scenario is improved by 287.16 %, while the API is reduced by 91.81 %. In addition, SSCF and CEF alone are significantly better than traditional generalized coherence factor and coherence factor algorithms.
期刊介绍:
Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:
• Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.
• Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.
• Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.
• Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.
Etc...