A Novel Approach to Dynamic Equi-Biaxial Testing of Thin Flexible Materials Using the Ring-on-Ring Test Method

IF 2 3区 工程技术 Q2 MATERIALS SCIENCE, CHARACTERIZATION & TESTING
K. Goyal, C. Singh, G. Subhash
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引用次数: 0

Abstract

Background

The current ASTM formulation for determining dynamic ring-on-ring test method is applicable for thick plates and is not suitable for thin plates that can undergo large flexural deformation where membrane stresses dominate.

Objective

The objective is to design and develop a new dynamic ring-on-ring test method with the ability to accurately measure load and visually access the tensile surface of a specimen for tracking failure. It is also aimed to develop a scientifically robust test procedure and analysis method to validate this new design for obtaining accurate biaxial flexural strength of thin flexible plates.

Methods

A unique load-cell assembly that houses a doughnut-shaped loadcell and capable of preloading the loadcell to a desired force level while simultaneously providing an unobstructed line-of-sight for a high-speed camera to capture the evolving damage modes in the specimen is developed. This loadcell assembly is used in a Hopkinson bar setup to test thin glass specimens and determine their dynamic biaxial flexural fracture strength. A new calibration procedure is proposed that accounts for the delay in the force sensed by the loadcell and provides a more accurate measure of the applied dynamic load on the specimen surface. An analysis method that accounts for membrane stresses under axisymmetric loading is developed to determine the biaxial failure strength of thin glass specimens that undergo large flexural deformation.

Results

A loadcell calibration method, an experimental procedure to dynamically test thin flexible specimens, and an analysis method that accounts for membrane stresses were developed. The Experimental results for three types of thin transparent materials reveal that the dynamic flexural failure strength is 40% more than their corresponding quasistatic strength. Radial cracks evolve from a preexisting defect during the biaxial loading and the damage growth rate was determined to be 1570 m/s.

Conclusions

The results reveal that the formulation suggested by the ASTM standard overpredicts the failure strength of thin glass specimen by several times the strength determined by the developed analytical method that accounts for the membrane stress. The analysis procedure provides a repeatable measurement of dynamic biaxial failure strength of flexible thin plates.

一种基于环对环试验方法的柔性薄材料动态等双轴测试新方法
背景:目前用于确定动态环对环试验方法的ASTM公式适用于厚板,不适用于薄膜应力占主导地位的薄板,因为薄板可以承受较大的弯曲变形。目的设计和开发一种新的动态环对环测试方法,该方法能够准确测量载荷并直观地访问试样的拉伸表面以跟踪故障。同时,还将开发一种科学可靠的测试程序和分析方法来验证这种新设计,以获得精确的柔性薄板双轴弯曲强度。方法开发了一种独特的测压元件组件,该组件容纳一个甜甜圈形状的测压元件,能够将测压元件预加载到所需的力水平,同时为高速摄像机提供无障碍的视线,以捕捉试样中不断变化的损伤模式。该称重传感器组件用于霍普金森杆装置,用于测试薄玻璃样品并确定其动态双轴弯曲断裂强度。提出了一种新的校准程序,该程序考虑了称重传感器感测力的延迟,并提供了对施加在试样表面的动载荷的更准确的测量。提出了一种考虑轴对称载荷下膜应力的分析方法,用于确定受大弯曲变形的薄玻璃试样的双轴破坏强度。结果建立了称重传感器标定方法、柔性薄试件动态测试的实验程序和考虑薄膜应力的分析方法。对三种透明薄材料的试验结果表明,其动态抗弯破坏强度比准静态强度高40%。在双轴加载过程中,径向裂纹由先前存在的缺陷演变而来,损伤扩展速率为1570 m/s。结论ASTM标准所建议的公式对薄玻璃试样的破坏强度的预测是考虑薄膜应力的分析方法所确定的强度的数倍。分析程序提供了柔性薄板动态双轴破坏强度的可重复测量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Experimental Mechanics
Experimental Mechanics 物理-材料科学:表征与测试
CiteScore
4.40
自引率
16.70%
发文量
111
审稿时长
3 months
期刊介绍: Experimental Mechanics is the official journal of the Society for Experimental Mechanics that publishes papers in all areas of experimentation including its theoretical and computational analysis. The journal covers research in design and implementation of novel or improved experiments to characterize materials, structures and systems. Articles extending the frontiers of experimental mechanics at large and small scales are particularly welcome. Coverage extends from research in solid and fluids mechanics to fields at the intersection of disciplines including physics, chemistry and biology. Development of new devices and technologies for metrology applications in a wide range of industrial sectors (e.g., manufacturing, high-performance materials, aerospace, information technology, medicine, energy and environmental technologies) is also covered.
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