Comprehensive study on fabrication, characterization and performance evaluation of Ag/TiOx/ITO and Au/Ag/TiOx/ITO memristors

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Kubra Saka, Dincer Gokcen, Halil Ibrahim Efkere, Cem Bayram, Suleyman Ozcelik
{"title":"Comprehensive study on fabrication, characterization and performance evaluation of Ag/TiOx/ITO and Au/Ag/TiOx/ITO memristors","authors":"Kubra Saka,&nbsp;Dincer Gokcen,&nbsp;Halil Ibrahim Efkere,&nbsp;Cem Bayram,&nbsp;Suleyman Ozcelik","doi":"10.1007/s10854-025-14894-w","DOIUrl":null,"url":null,"abstract":"<div><p>The structure of electrodes and active materials in memristors plays a critical role in determining their electrical behavior. This study primarily focuses on Ag/TiOₓ/ITO and Au/Ag/TiOₓ/ITO memristors incorporating titanium oxide (TiOₓ) thin films with varying thicknesses (25, 50, and 100 nm), deposited via RF magnetron sputtering onto ITO-coated glass substrates. Comprehensive surface characterization techniques, including scanning electron microscopy (SEM), electron dispersive X-ray spectroscopy (EDX), atomic force microscopy (AFM), Raman spectroscopy, and X-ray photoelectron spectroscopy (XPS), were employed to examine the morphological, structural, and chemical properties of the films. SEM–EDX mapping revealed thickness dependent elemental distributions. AFM analysis showed increased surface roughness (1.69 to 2.15 nm) and grain size (60 to 90 nm) with increasing film thickness. XPS measurements conducted at 8-week intervals provided insights into the oxidation behavior of Ag electrodes and their surface chemistry evolution over time. Raman analysis confirmed the presence of anatase and rutile phases in the titanium oxide thin films, as evidenced by the characteristic peaks observed at 196.83 cm<sup>−1</sup> and 607.43 cm<sup>−1</sup>, respectively. Focused ion beam (FIB) and scanning transmission electron microscopy (STEM)-EDX were also utilized to investigate elemental boundaries between the layers. Bipolar resistive switching behavior, without the need for any electroforming process, was observed in all devices within 7 days of fabrication and remained stable throughout 1000 current–voltage (I–V) cycles. After 8 weeks of storage, further endurance tests were conducted using ± 1.5 V SET and RESET voltages, with HRS and LRS values measured at a read voltage of 0.5 V. Notably, the highest HRS/LRS ratio of 16.07 was achieved in the Ag/TiO<sub>x</sub>/ITO memristor with a 100 nm TiO<sub>x</sub> layer. These findings underscore the critical influence of oxide thickness on resistive switching performance and endurance. Furthermore, the comparative evaluation of Ag and Au-passivated Ag electrodes highlights the significance of electrode configuration in enhancing memristor reliability and long-term operational stability.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 14","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://link.springer.com/content/pdf/10.1007/s10854-025-14894-w.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14894-w","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

The structure of electrodes and active materials in memristors plays a critical role in determining their electrical behavior. This study primarily focuses on Ag/TiOₓ/ITO and Au/Ag/TiOₓ/ITO memristors incorporating titanium oxide (TiOₓ) thin films with varying thicknesses (25, 50, and 100 nm), deposited via RF magnetron sputtering onto ITO-coated glass substrates. Comprehensive surface characterization techniques, including scanning electron microscopy (SEM), electron dispersive X-ray spectroscopy (EDX), atomic force microscopy (AFM), Raman spectroscopy, and X-ray photoelectron spectroscopy (XPS), were employed to examine the morphological, structural, and chemical properties of the films. SEM–EDX mapping revealed thickness dependent elemental distributions. AFM analysis showed increased surface roughness (1.69 to 2.15 nm) and grain size (60 to 90 nm) with increasing film thickness. XPS measurements conducted at 8-week intervals provided insights into the oxidation behavior of Ag electrodes and their surface chemistry evolution over time. Raman analysis confirmed the presence of anatase and rutile phases in the titanium oxide thin films, as evidenced by the characteristic peaks observed at 196.83 cm−1 and 607.43 cm−1, respectively. Focused ion beam (FIB) and scanning transmission electron microscopy (STEM)-EDX were also utilized to investigate elemental boundaries between the layers. Bipolar resistive switching behavior, without the need for any electroforming process, was observed in all devices within 7 days of fabrication and remained stable throughout 1000 current–voltage (I–V) cycles. After 8 weeks of storage, further endurance tests were conducted using ± 1.5 V SET and RESET voltages, with HRS and LRS values measured at a read voltage of 0.5 V. Notably, the highest HRS/LRS ratio of 16.07 was achieved in the Ag/TiOx/ITO memristor with a 100 nm TiOx layer. These findings underscore the critical influence of oxide thickness on resistive switching performance and endurance. Furthermore, the comparative evaluation of Ag and Au-passivated Ag electrodes highlights the significance of electrode configuration in enhancing memristor reliability and long-term operational stability.

Ag/TiOx/ITO和Au/Ag/TiOx/ITO忆阻器的制备、表征和性能评价的综合研究
忆阻器中电极和活性材料的结构对其电性能起着至关重要的作用。本研究主要关注Ag/TiOₓ/ITO和Au/Ag/TiOₓ/ITO忆阻器,这些忆阻器采用不同厚度(25、50和100 nm)的氧化钛(TiOₓ)薄膜,通过射频磁控溅射沉积在ITO涂层的玻璃基板上。利用扫描电子显微镜(SEM)、电子色散x射线能谱(EDX)、原子力显微镜(AFM)、拉曼光谱(Raman spectroscopy)和x射线光电子能谱(XPS)等综合表面表征技术对膜的形态、结构和化学性质进行了研究。SEM-EDX映射显示了与厚度相关的元素分布。AFM分析表明,随着膜厚的增加,表面粗糙度(1.69 ~ 2.15 nm)和晶粒尺寸(60 ~ 90 nm)均有所增加。每隔8周进行一次XPS测量,可以深入了解Ag电极的氧化行为及其表面化学变化。拉曼分析证实了氧化钛薄膜中锐钛矿相和金红石相的存在,特征峰分别位于196.83 cm−1和607.43 cm−1。聚焦离子束(FIB)和扫描透射电子显微镜(STEM)-EDX也被用来研究层之间的元素边界。在不需要任何电铸工艺的情况下,在制造后7天内观察到所有器件的双极电阻开关行为,并在1000个电流-电压(I-V)循环中保持稳定。储存8周后,在±1.5 V的SET和RESET电压下进行进一步的耐久测试,在0.5 V的读电压下测量HRS和LRS值。值得注意的是,具有100 nm TiOx层的Ag/TiOx/ITO忆阻器的HRS/LRS比最高,为16.07。这些发现强调了氧化物厚度对电阻开关性能和耐用性的关键影响。此外,对Ag和au钝化Ag电极的比较评价强调了电极配置在提高忆阻器可靠性和长期工作稳定性方面的重要性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信