Mohammad Anwar Parvez, Mobasserul Islam, Salma Sultana, Masdud Ali, Rakebul Hossain Molla, Abul Hassan, Rajesh Theravalappil, Mohammad A. Hasnat, Nayan Ranjan Singha, Mostafizur Rahaman
{"title":"Recent development on polymer based light weight electromagnetic interference shielding materials","authors":"Mohammad Anwar Parvez, Mobasserul Islam, Salma Sultana, Masdud Ali, Rakebul Hossain Molla, Abul Hassan, Rajesh Theravalappil, Mohammad A. Hasnat, Nayan Ranjan Singha, Mostafizur Rahaman","doi":"10.1007/s10854-025-14836-6","DOIUrl":null,"url":null,"abstract":"<div><p>The rapid advancement of modern electronic technologies has significantly enhanced social production efficiency, but it has also led to an increase in electromagnetic interference (EMI). As a result, electromagnetic shielding materials have gained considerable attention, particularly in the context of lightweight and highly integrated electronic devices. Polymers are widely utilized in EMI shielding applications due to their unique properties, such as light weight, high flexibility, and excellent corrosion resistance. This review focuses on well-studied polymer-based lightweight composites. The fundamental theory of EMI shielding is thoroughly introduced, and current testing methods for evaluating shielding effectiveness are summarized to assist in the development of design principles for effective shielding materials. Additionally, the impact of various carbon materials—classified into zero-dimensional, one-dimensional, two-dimensional, and three-dimensional forms—on shielding performance is discussed, along with their corresponding shielding mechanisms. These advanced lightweight materials with superior EMI shielding properties hold immense potential for applications across diverse sectors, including communications, electronics, aerospace, military, and environmental protection.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 14","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-05-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14836-6","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The rapid advancement of modern electronic technologies has significantly enhanced social production efficiency, but it has also led to an increase in electromagnetic interference (EMI). As a result, electromagnetic shielding materials have gained considerable attention, particularly in the context of lightweight and highly integrated electronic devices. Polymers are widely utilized in EMI shielding applications due to their unique properties, such as light weight, high flexibility, and excellent corrosion resistance. This review focuses on well-studied polymer-based lightweight composites. The fundamental theory of EMI shielding is thoroughly introduced, and current testing methods for evaluating shielding effectiveness are summarized to assist in the development of design principles for effective shielding materials. Additionally, the impact of various carbon materials—classified into zero-dimensional, one-dimensional, two-dimensional, and three-dimensional forms—on shielding performance is discussed, along with their corresponding shielding mechanisms. These advanced lightweight materials with superior EMI shielding properties hold immense potential for applications across diverse sectors, including communications, electronics, aerospace, military, and environmental protection.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.