Recent development on polymer based light weight electromagnetic interference shielding materials

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Mohammad Anwar Parvez, Mobasserul Islam, Salma Sultana, Masdud Ali, Rakebul Hossain Molla, Abul Hassan, Rajesh Theravalappil, Mohammad A. Hasnat, Nayan Ranjan Singha, Mostafizur Rahaman
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Abstract

The rapid advancement of modern electronic technologies has significantly enhanced social production efficiency, but it has also led to an increase in electromagnetic interference (EMI). As a result, electromagnetic shielding materials have gained considerable attention, particularly in the context of lightweight and highly integrated electronic devices. Polymers are widely utilized in EMI shielding applications due to their unique properties, such as light weight, high flexibility, and excellent corrosion resistance. This review focuses on well-studied polymer-based lightweight composites. The fundamental theory of EMI shielding is thoroughly introduced, and current testing methods for evaluating shielding effectiveness are summarized to assist in the development of design principles for effective shielding materials. Additionally, the impact of various carbon materials—classified into zero-dimensional, one-dimensional, two-dimensional, and three-dimensional forms—on shielding performance is discussed, along with their corresponding shielding mechanisms. These advanced lightweight materials with superior EMI shielding properties hold immense potential for applications across diverse sectors, including communications, electronics, aerospace, military, and environmental protection.

Abstract Image

高分子基轻质电磁干扰屏蔽材料的研究进展
现代电子技术的飞速发展大大提高了社会的生产效率,但同时也导致了电磁干扰(EMI)的增加。因此,电磁屏蔽材料已经获得了相当大的关注,特别是在轻量化和高度集成的电子设备的背景下。聚合物由于其独特的性能,如重量轻、高柔韧性和优异的耐腐蚀性,被广泛应用于电磁干扰屏蔽应用。本文综述了目前研究较多的聚合物基轻量化复合材料。全面介绍了电磁干扰屏蔽的基本理论,总结了目前评估屏蔽效能的测试方法,以帮助制定有效屏蔽材料的设计原则。此外,还讨论了各种碳材料(分为零维、一维、二维和三维形式)对屏蔽性能的影响及其相应的屏蔽机制。这些先进的轻质材料具有优异的EMI屏蔽性能,在通信、电子、航空航天、军事和环境保护等各个领域的应用中具有巨大的潜力。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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