{"title":"Influence of JFET Region on Heavy-Ion-Induced Gate Damage in SiC Power MOSFET","authors":"Manyi Ji;Na Ren;Yanjun Li;Zhengjia Chen;Hongyi Xu;Kuang Sheng;Xin Wan;Hu Jin;Jun Xu","doi":"10.1109/TNS.2025.3555307","DOIUrl":null,"url":null,"abstract":"Heavy-ion induced latent gate damage (LGD) and single-event leakage current (SELC) related to gate damage in silicon carbide (SiC) power MOSFETs were investigated by experiment and simulation. This study verified the strong influence of width and doping concentration of the JFET region of a SiC MOSFET on the sensitivity to heavy-ion-induced gate damage, including LGD and SELC related to gate damage. Failure analysis was conducted to confirm the damage in the gate oxide. Heavy-ion transient technology computer aided design (TCAD) simulations were carried out to confirm the impact of maximum gate oxide electric field during irradiation on gate damage and type of single-event effects (SEEs). This study also provides a feasible way to harden SiC MOSFETs in a radiation environment by reducing the maximum gate oxide electrical field during exposure to heavy ions.","PeriodicalId":13406,"journal":{"name":"IEEE Transactions on Nuclear Science","volume":"72 5","pages":"1726-1733"},"PeriodicalIF":1.9000,"publicationDate":"2025-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Nuclear Science","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10943234/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Heavy-ion induced latent gate damage (LGD) and single-event leakage current (SELC) related to gate damage in silicon carbide (SiC) power MOSFETs were investigated by experiment and simulation. This study verified the strong influence of width and doping concentration of the JFET region of a SiC MOSFET on the sensitivity to heavy-ion-induced gate damage, including LGD and SELC related to gate damage. Failure analysis was conducted to confirm the damage in the gate oxide. Heavy-ion transient technology computer aided design (TCAD) simulations were carried out to confirm the impact of maximum gate oxide electric field during irradiation on gate damage and type of single-event effects (SEEs). This study also provides a feasible way to harden SiC MOSFETs in a radiation environment by reducing the maximum gate oxide electrical field during exposure to heavy ions.
期刊介绍:
The IEEE Transactions on Nuclear Science is a publication of the IEEE Nuclear and Plasma Sciences Society. It is viewed as the primary source of technical information in many of the areas it covers. As judged by JCR impact factor, TNS consistently ranks in the top five journals in the category of Nuclear Science & Technology. It has one of the higher immediacy indices, indicating that the information it publishes is viewed as timely, and has a relatively long citation half-life, indicating that the published information also is viewed as valuable for a number of years.
The IEEE Transactions on Nuclear Science is published bimonthly. Its scope includes all aspects of the theory and application of nuclear science and engineering. It focuses on instrumentation for the detection and measurement of ionizing radiation; particle accelerators and their controls; nuclear medicine and its application; effects of radiation on materials, components, and systems; reactor instrumentation and controls; and measurement of radiation in space.