Effect of Ni-interlayer addition and aging on the mechanical properties of the diffusion bonded alloy 800H

IF 3.8 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Vacuum Pub Date : 2025-05-11 DOI:10.1016/j.vacuum.2025.114404

Taejeong An, Muthu Shanmugam Mannan, Ji-Hwan Cha, Changheui Jang

{"title":"Effect of Ni-interlayer addition and aging on the mechanical properties of the diffusion bonded alloy 800H","authors":"Taejeong An, Muthu Shanmugam Mannan, Ji-Hwan Cha, Changheui Jang","doi":"10.1016/j.vacuum.2025.114404","DOIUrl":null,"url":null,"abstract":"<div><div>Fabrication of compact and complex design printed circuit heat exchangers (PCHEs) using Alloy 800H is difficult by traditional welding methods due to the formation of hot cracking and brittle carbide phases, which significantly affect the joint properties. To overcome these issues, the diffusion bonding process was utilized to produce the Alloy 800H joints, with and without Ni-interlayer. Large Ti-rich precipitates were found in the diffusion-bonded interface of joints prepared without and 1 μm-thick Ni-interlayer. Increasing the Ni-interlayer thickness reduced the precipitates size, leading to significant improvements in tensile strength by 156 % at room temperature and 142 % at 650 °C compared to the as-diffusion bonded joint. After aging, the tensile strength of the DB joint increased by 19.85 % and 34.12 % compared to non-aged specimens due to the formation of gamma prime (γ′) phases and Cr-rich precipitates, despite a decrease in elongation. Nonetheless, the fracture occurred away from the bond line.</div></div>","PeriodicalId":23559,"journal":{"name":"Vacuum","volume":"239 ","pages":"Article 114404"},"PeriodicalIF":3.8000,"publicationDate":"2025-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Vacuum","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0042207X2500394X","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

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Abstract

Fabrication of compact and complex design printed circuit heat exchangers (PCHEs) using Alloy 800H is difficult by traditional welding methods due to the formation of hot cracking and brittle carbide phases, which significantly affect the joint properties. To overcome these issues, the diffusion bonding process was utilized to produce the Alloy 800H joints, with and without Ni-interlayer. Large Ti-rich precipitates were found in the diffusion-bonded interface of joints prepared without and 1 μm-thick Ni-interlayer. Increasing the Ni-interlayer thickness reduced the precipitates size, leading to significant improvements in tensile strength by 156 % at room temperature and 142 % at 650 °C compared to the as-diffusion bonded joint. After aging, the tensile strength of the DB joint increased by 19.85 % and 34.12 % compared to non-aged specimens due to the formation of gamma prime (γ′) phases and Cr-rich precipitates, despite a decrease in elongation. Nonetheless, the fracture occurred away from the bond line.

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层间添加ni及时效对扩散结合合金800H力学性能的影响

采用Alloy 800H制备紧凑、复杂设计的印刷电路换热器（PCHEs），由于其形成热裂纹和脆性碳化物相，严重影响接头性能，传统焊接方法难以实现。为了克服这些问题，采用扩散连接工艺生产了合金800H接头，有和没有ni中间层。在未添加1 μm厚的ni中间层的情况下，在扩散键合界面中发现了大量富ti析出物。增加ni层间厚度减少了析出相的尺寸，导致与扩散结合接头相比，室温和650℃的抗拉强度分别提高了156%和142%。时效后，尽管伸长率下降，但由于γ素相（γ′）和富cr析出相的形成，与未时效的试样相比，DB接头的抗拉强度分别提高了19.85%和34.12%。尽管如此，骨折发生在远离结合线的地方。

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来源期刊

Vacuum 工程技术-材料科学：综合

CiteScore

6.80

自引率

17.50%

发文量

审稿时长

34 days

期刊介绍： Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.