Stress-engineered ultra-broadband spectrometers

Abstract

The evolution of miniaturized spectroscopic tools is pivotal for expanding the application of spectral data across scientific, industrial, and consumer domains. Recent advancements in computationally augmented systems have dramatically reduced device form factors toward those compatible with consumer tech integration. However, for a commercial reality, most applications demand operation across visible to short-wave infrared (SWIR) range. In this regard, existing miniaturized devices are either constrained by physical properties; use complex, costly, or unscalable fabrication techniques; or require multiple components to address separate parts of the spectrum. Here, we report on a low-cost, visible to SWIR, miniaturized spectrometer design enabled by a mass-producible, nonlithographic method of engineering planar dispersive elements from widely available plastics. By deforming shape memory epoxies, we encode spectral information, which is processed by a complementary metal oxide semiconductor sensor array and reconstructed via algorithms. This design offers broadband capability from 400 to 1600 nanometers and enables line-scanning spectral imaging, paving the way for affordable spectrometers.