{"title":"Self-assembly of graphene foam anchored with magnetic Fe2O3 nanocrystals for high efficient electromagnetic wave absorption","authors":"Qi Yu, Yunlong Wang, Yiyi Wang, Chenglong Du, Zhengqian Zhang, Daming Zheng","doi":"10.1007/s10854-025-14921-w","DOIUrl":null,"url":null,"abstract":"<div><p>Three-dimensional (3D) graphene based materials have many advantages including low density, large specific surface area, high electrical conductivity, abundance of pores and good mechanical compressibility, which make them considered as potential candidate for electromagnetic wave (EMW) absorption materials. In this study, the 3D graphene foam anchored with magnetic Fe<sub>2</sub>O<sub>3</sub> nanocrystals using diethylene glycol as solvent (3D-DEG-rGO@Fe<sub>2</sub>O<sub>3</sub>) were prepared by solvothermal method, synchronously realizing the self-assembly of 3D graphene and in-situ reduction of magnetic Fe<sub>2</sub>O<sub>3</sub> nanoparticles without any reducing agent. The 3D-DEG-rGO@Fe<sub>2</sub>O<sub>3</sub> demonstrates excellent microwave absorption due to good impedance matching and synergistic electromagnetic loss mechanisms as well as porous network structure. The minimum reflection loss (RL<sub>min</sub>) is − 63.86 dB at 12.47 GHz with a thin thickness of only 2.28 mm, and the effective frequency bandwidth with the RL values less than − 10 dB is 5.53 GHz in the range of 12.47–18 GHz. The 3D-DEG-rGO@Fe<sub>2</sub>O<sub>3</sub> foam with extremely low bulk density, excellent EMW absorption ability and good compression recovery, can be attractive candidate materials for EMW absorption applications.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 14","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14921-w","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Three-dimensional (3D) graphene based materials have many advantages including low density, large specific surface area, high electrical conductivity, abundance of pores and good mechanical compressibility, which make them considered as potential candidate for electromagnetic wave (EMW) absorption materials. In this study, the 3D graphene foam anchored with magnetic Fe2O3 nanocrystals using diethylene glycol as solvent (3D-DEG-rGO@Fe2O3) were prepared by solvothermal method, synchronously realizing the self-assembly of 3D graphene and in-situ reduction of magnetic Fe2O3 nanoparticles without any reducing agent. The 3D-DEG-rGO@Fe2O3 demonstrates excellent microwave absorption due to good impedance matching and synergistic electromagnetic loss mechanisms as well as porous network structure. The minimum reflection loss (RLmin) is − 63.86 dB at 12.47 GHz with a thin thickness of only 2.28 mm, and the effective frequency bandwidth with the RL values less than − 10 dB is 5.53 GHz in the range of 12.47–18 GHz. The 3D-DEG-rGO@Fe2O3 foam with extremely low bulk density, excellent EMW absorption ability and good compression recovery, can be attractive candidate materials for EMW absorption applications.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.