Sintering of Cu nanoparticles for optimized particle size and enhanced interconnect performance

IF 5.5 3区工程技术 Q1 ENGINEERING, CHEMICAL

Journal of the Taiwan Institute of Chemical Engineers Pub Date : 2025-05-15 DOI:10.1016/j.jtice.2025.106185

Ping-Hsuan Chen , Hung Wang , Kelvin Li , Chang-Meng Wang , Cheng-Yi Liu , Albert T. Wu

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引用次数: 0

Abstract

Background

The performance and reliability of wide-bandgap devices depend on achieving effective Cu-Cu bonding, which requires control over critical processing conditions. Copper nanoparticles (Cu NPs) with controlled sizes are introduced to improve Cu-Cu bonding in electronic packaging.

Methods

A green chemical method was used to reduce CuO and synthesize Cu nanoparticles (Cu NPs), which were then applied to achieve Cu-to-Cu bonding. The bonding process was conducted at low temperature without pressure, utilizing polyethylene glycol (PEG) as both solvent and reducing agent. The mechanical and electrical properties of the Cu NPs paste joint were measured by shear testing and four-point probe measurement.

Significant findings

This study explores the nucleation and growth mechanisms of copper nanoparticles (Cu NPs) and their role in optimizing bonding conditions through control of surface oxidation. The effect of pH on synthesis parameters is emphasized, demonstrating its significant influence on particle size, distribution, and sintering properties. A model is proposed to elucidate the competition between surface energy and reduction energy within the Cu₂O layer, providing insights into optimal sintering conditions. These advancements in Cu NP synthesis and sintering technology result in improved mechanical properties, including increased shear strength, reduced void ratios, and higher density in bonded structures.

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烧结铜纳米颗粒优化粒径和增强互连性能

宽带隙器件的性能和可靠性取决于能否实现有效的Cu-Cu键合，这就需要对关键的工艺条件进行控制。为了改善电子封装中的Cu-Cu键合，引入了尺寸可控的铜纳米颗粒（Cu NPs）。方法采用绿色化学法还原CuO，合成Cu纳米粒子（Cu NPs），实现Cu- Cu键合。以聚乙二醇（PEG）为溶剂和还原剂，在低温无压力条件下进行键合。采用剪切试验和四点探针法测定了铜NPs膏体接头的力学性能和电学性能。本研究探讨了铜纳米粒子（Cu NPs）的成核和生长机制，以及它们通过控制表面氧化来优化键合条件的作用。强调了pH对合成参数的影响，证明了其对粒度、分布和烧结性能的显著影响。提出了一个模型来阐明Cu2O层内表面能和还原能之间的竞争，为最佳烧结条件提供见解。这些Cu NP合成和烧结技术的进步改善了材料的机械性能，包括增加了抗剪强度，降低了空隙率，提高了粘结结构的密度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of the Taiwan Institute of Chemical Engineers 工程技术-工程：化工

CiteScore

9.10

自引率

14.00%

发文量

362

审稿时长

35 days

期刊介绍： Journal of the Taiwan Institute of Chemical Engineers (formerly known as Journal of the Chinese Institute of Chemical Engineers) publishes original works, from fundamental principles to practical applications, in the broad field of chemical engineering with special focus on three aspects: Chemical and Biomolecular Science and Technology, Energy and Environmental Science and Technology, and Materials Science and Technology. Authors should choose for their manuscript an appropriate aspect section and a few related classifications when submitting to the journal online.