Investigation of the impact of Ti doping on graphene in the structural resistance of copper-graphene nanolayer composites using molecular dynamics (MD) simulations

IF 2.5 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
F. Mirzaei Mohammadabadi, Behnam Azadegan, J. Baedi, E. Koushki, M. Amini
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Abstract

In environments exposed to high neutron radiation, understanding the relationship between structural stability and the number of defects is essential. This knowledge aids in designing materials with high radiation tolerance and in predicting their behavior under various irradiation conditions. In this study, the radiation resistance and interface stability of a Ti-doped copper–graphene nanolayer composite are examined using atomistic simulations. The graphene layer within the copper–graphene nanocomposite is doped with Ti atoms at concentrations of 0.005, 0.01, 0.02, 0.03, 0.035, and 0.04 wt%. Simulations are conducted for primary knock-on atoms (PKA) with energies of 3, 6, and 9 keV. The study focuses on factors such as the number of surviving point defects as a function of the PKA distance from the graphene layer, the evolution of kinetic and total energy of atoms, and the number of point defects (vacancies and interstitials) versus different Ti concentrations. The findings reveal that Ti doping significantly reduces the number of defects up to a specific concentration, thereby improving the structural stability of the nanocomposite.

利用分子动力学(MD)模拟研究Ti掺杂对石墨烯在铜-石墨烯纳米层复合材料结构电阻的影响
在暴露于高中子辐射的环境中,了解结构稳定性与缺陷数量之间的关系至关重要。这些知识有助于设计具有高辐射耐受性的材料,并预测其在各种辐射条件下的行为。在这项研究中,使用原子模拟研究了ti掺杂铜-石墨烯纳米层复合材料的耐辐射性能和界面稳定性。在铜-石墨烯纳米复合材料中的石墨烯层中掺杂浓度分别为0.005、0.01、0.02、0.03、0.035和0.04 wt%的Ti原子。对能量为3,6和9kev的初级撞击原子(PKA)进行了模拟。研究的重点是一些因素,如点缺陷的数量作为PKA距离石墨烯层的函数,原子的动能和总能量的演变,以及点缺陷(空位和间隙)的数量随不同Ti浓度的变化。研究结果表明,在特定浓度下,Ti的掺杂显著减少了缺陷的数量,从而提高了纳米复合材料的结构稳定性。
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来源期刊
Applied Physics A
Applied Physics A 工程技术-材料科学:综合
CiteScore
4.80
自引率
7.40%
发文量
964
审稿时长
38 days
期刊介绍: Applied Physics A publishes experimental and theoretical investigations in applied physics as regular articles, rapid communications, and invited papers. The distinguished 30-member Board of Editors reflects the interdisciplinary approach of the journal and ensures the highest quality of peer review.
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