The synergistic inhibition of the growth of intermetallic compounds at Sn-0.7Cu/Cu interface by Al and Pt

IF 9.6 1区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Rare Metals Pub Date : 2025-03-06 DOI:10.1007/s12598-024-03200-y

An-Cang Yang, Yao-Ping Lu, Bin Zhang, Yong-Hua Duan, Li-Shi Ma, Shan-Ju Zheng, Ming-Jun Peng, Meng-Nie Li, Zhi-Hang Xu

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引用次数: 0

Abstract

The construction of intermetallic compounds (IMCs) connection layers with special compositions by adding small amounts of alloying elements has been proven to be an effective strategy for improving the reliability of electronic component interconnect. However, the synergistic effect mechanism of multi-component alloy compositions on the growth behavior of IMCs is not clear. Herein, we successfully prepared a new quaternary alloy solder with a composition of Sn-0.7Cu-0.175Pt-0.025Al (wt%) using the high-throughput screening (HTS) method. The results showed that it possesses excellent welding performance with an inhibition rate over 40% on the growth of IMCs layers. For Cu₆Sn₅, the co-doping of Al and Pt not only greatly improves its thermodynamic stability, but also effectively suppresses the phase transition. Meanwhile, the co-doping of Al and Pt also significantly delays the generation time of Kirkendall defects. The substitution sites of Al and Pt in Cu₆Sn₅ have been explored using atomic resolution imaging and advanced data informatics, indicating that Al and Pt preferentially substitute Sn and Cu atoms, respectively, to generate (Cu, Pt)₆(Sn, Al)₅. A one-dimensional (1D) kinetic model of the IMCs layer growth at the Sn solder/Cu substrate interface was derived and validated, and the results showed that the error of the derived mathematical model is less than 5%. Finally, the synergistic mechanism of Al and Pt co-doping on the growth rate of Cu₆Sn₅ was further elucidated. This work provides a feasible route for the design and development of multi-component alloy solders.

Graphical abstract

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Al和Pt对Sn-0.7Cu/Cu界面金属间化合物生长的协同抑制作用

通过添加少量合金元素来构建具有特殊成分的金属间化合物（IMCs）连接层已被证明是提高电子元件互连可靠性的有效策略。然而，多组分合金成分对IMCs生长行为的协同作用机制尚不清楚。本文采用高通量筛选（high-throughput screening， HTS）方法成功制备了Sn-0.7Cu-0.175Pt-0.025Al （wt%）的新型季元合金钎料。结果表明，该材料具有优异的焊接性能，对IMCs层生长的抑制率超过40%。对于Cu6Sn5， Al和Pt的共掺杂不仅大大提高了其热力学稳定性，而且有效地抑制了相变。同时，Al和Pt的共掺杂也显著延迟了Kirkendall缺陷的生成时间。利用原子分辨率成像和先进的数据信息学技术对Cu6Sn5中Al和Pt的取代位点进行了探索，表明Al和Pt分别优先取代Sn和Cu原子生成（Cu, Pt）6(Sn, Al)5。建立并验证了锡钎料/Cu衬底界面处IMCs层生长的一维动力学模型，结果表明该数学模型的误差小于5%。最后，进一步阐明了Al和Pt共掺杂对Cu6Sn5生长速率的协同作用机制。本工作为多组分合金焊料的设计与开发提供了一条可行的途径。图形抽象

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来源期刊

Rare Metals 工程技术-材料科学：综合

CiteScore

12.10

自引率

12.50%

发文量

2919

审稿时长

2.7 months

期刊介绍： Rare Metals is a monthly peer-reviewed journal published by the Nonferrous Metals Society of China. It serves as a platform for engineers and scientists to communicate and disseminate original research articles in the field of rare metals. The journal focuses on a wide range of topics including metallurgy, processing, and determination of rare metals. Additionally, it showcases the application of rare metals in advanced materials such as superconductors, semiconductors, composites, and ceramics.